Ah.. ok I'll elaborate further.
TECing (not a standard term of expression.. yet) is the usage of a TEC = Thermo Electric Cooler, also known as a Peltier cooler.
It's a kind of heat pump. (There is lots to read about it here, just search for "pelt", "peltier", TEC is too short I think.)
In short it's a flat square, thin wafer that moves the heat from an object and ejects it on the cooler on the other side.
The object(cpu) is cooled by removing the heat.
On the backside of mobo I guess that there is a whole lot of soldering points, tin pads. If you are lucky, there isn't any pins or components that stick out from the MB under the socket. If there are pins or loads of components portruding on the back, I wouldn't try to cool it.
Those tin pads must never be shorted by a peice of metal(or anything else). If they are, MB and/or CPU + maybe PowerSupply go bye bye.
Those tightly packed solder points or tin pads(arranged like the socket on the other side) is what you'd be wanting to cool.
I have been tinking of cooling them, not actually done it, since I trying to figure wether it will be worth it or not.
Did that clear things up? no? yes?