- Joined
- Jul 25, 2003
- Location
- Rio de Janeiro
Arctic Ceramique Thermal OR Arctic Silver III Thermal Compound
For a P4
For a P4
-
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Which out of these.....
- Thread starter Jimbob7
- Start date
- Joined
- Apr 14, 2003
- Location
- Brooklyn
either one is fine =d they give similiar results but i did find ceramique cleans up a bit easier.. plus its a dollar or two cheaper
- Joined
- Feb 13, 2001
- Location
- West Central MN
I guess I would agree. I would go with Ceramique too.
OP
- Joined
- Jul 25, 2003
- Location
- Rio de Janeiro
- Thread Starter
- #6
hehe thanks but how exactly can it be harder??
also on the here i have seen alo of ppl say put a think layer on blah blah blah, but on the artic silver site theere is a pic where the it has just been squashed down by the heat sink :S:S no im really confused heh
but how exactly can it be harder??also on the here i have seen alo of ppl say put a think layer on blah blah blah, but on the artic silver site theere is a pic where the it has just been squashed down by the heat sink :S:S no im really confused heh
- Joined
- Aug 25, 2003
- Location
- In your girlfriend's Panties..
TOOLS REQUIRED:
One tube thermal compound
One Razor blade (credit card works if you're clumsy)
One Processor Die
DIRECTIONS:
Place single drop of thermal compound on top of die, while held in place by motherboard ZIF socket.
Direct thermal compound across entire surface by aid of a razor blade or other thin flat surface (much as one would when putting grout on a floor for placing ceramic tiles).
When flat, remove all but a 1mm thick layer of compound and replace remaining compound from flat implement, back into thermal compound container.
Attach heatsink, waterblock, shim(s), or evaporator and power on.
On a side note, if you use more than one shim, perform the same action for each shim layer until reaching surface of actual heat exchanger.
One tube thermal compound
One Razor blade (credit card works if you're clumsy)
One Processor Die
DIRECTIONS:
Place single drop of thermal compound on top of die, while held in place by motherboard ZIF socket.
Direct thermal compound across entire surface by aid of a razor blade or other thin flat surface (much as one would when putting grout on a floor for placing ceramic tiles).
When flat, remove all but a 1mm thick layer of compound and replace remaining compound from flat implement, back into thermal compound container.
Attach heatsink, waterblock, shim(s), or evaporator and power on.
On a side note, if you use more than one shim, perform the same action for each shim layer until reaching surface of actual heat exchanger.
OP
- Joined
- Jul 25, 2003
- Location
- Rio de Janeiro
- Thread Starter
- #8
Great thanks dude
Ehhh, goto www.arcticsiver.com and look at thier application directions... Follow them exactly
- Joined
- Sep 13, 2002
- Location
- Williamsport, PA
i use a sandwhich bag. put a small dab in the center of the heatsink and rub it into the sink until it's about the size of a quarter. as far as thickness goes it should be just thick enough so the base material won't show. my sink is copper and i smear it in until i see orange then i smooth it out so it looks all grey.
- Joined
- Jun 20, 2003
- Location
- Shallotte, NC
Ceramique...and i thought you were supposed to put it on the CPU?????????
- Joined
- Feb 11, 2003
- Location
- Bristol, UK.
yes, but use a razor blade to thin it out, and rub it in with a small plastic bag on the heatsink. Thats right children, die = razor blade, heatsink = rubby rubby plastic baggy, all very thin layers.
