Effect of high Vcore and electromigration on expected failure time for Tbred B/Barton
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Statistically, for the same level of temperature specification,
A 10% increase in Vcore, would shorten the failure time to 83% of nominal failure time.
A 20% increase in Vcore, would shorten the failure time to 69% of nominal failure time.
A 30% increase in Vcore, would shorten the failure time to 59% of nominal failure time.
A 50% increase in Vcore, would shorten the failure time to 44% of nominal failure time.
So a 30% increase of Vcore reduces the 50% sample failure time to 59%. 30% over stock voltage for Tbred B/Barton are
- 1.95 V for DLT3C, such as the famous Tbred B 1700+/1800+
- 2.08 V for DUT3C, such as the popular 2100+
- 2.15 V for DKT3C, such as the Barton 2500+ or higher.
E.g. If the nominal CPU life expectancy is 10 years, for Tbred B DLT3C
- 30% overvolt to 1.95 V, the number would be down to about 6 years (59%).
- 20% overvolt to 1.80 V, the number would be down to about 7 years (69%).
- 10% overvolt to 1.65 V, the number would be down to about 8.3 years (83%).
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As far as temperature to not having additional adverse effect on chip behavior from electromigration on top of voltage, it should be below the max temperature rating of 85/90 C (for TBred B/Barton). So using a temperature cap of 65-70 C is reasonable, since above which most CPU would be overclocked above the break-even point of 10 MHz/C for Tbred B and Barton. Further increase in voltage and temperature beyond 30% and 65 C, even if it is stable, one would get very little return in MHz, but greatly shortening the expected failure time. (Besides temperature is kept under 65-70 C, HSF, motherboard FSB, memory, PSU, ... are assumed not to be limiting the stablity of the system.)
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