PDL
07-27-01, 07:00 AM
Here is a question for anyone who may know about the production processes at AMD.
Or anyone else for that matter!
Is it possible that the L1 bridges are cut AFTER the chip is tested??
This would explain some DOA units if 1 or more of the L1s were not cut properly. Then, if the chip was not tested afterward...you would have a problem chip!!
What ya'll think???
Or anyone else for that matter!
Is it possible that the L1 bridges are cut AFTER the chip is tested??
This would explain some DOA units if 1 or more of the L1s were not cut properly. Then, if the chip was not tested afterward...you would have a problem chip!!
What ya'll think???