Gersen
05-25-01, 09:41 PM
Not being much of an overclocker, but having learned the details and getting ready to experiment, I checked out my existing equipment. I've had stability problems with this system before, and posted about it in General, got some input, made some changes, and it's better then before. Got a "Comp-u-Nurse" temp sensor and started checking taking some baseline readings.
When I pulled the standard heatsink off the place the temp probe, I found a piece of white plastic tape was still on the heatsink over the CPU die! That was most likely my instability problem, preventing heat transfer. When I peeled it off, it left a piece of brown tape with an adhesive face, which must have been some sort of thermal tape for mounting a heatsink. I figured I could do without it and peeled it off, put on a dab of heatsink compund and remounted it, with the temp probe right next to, and touching, the die.
Idling in Win98SE, with no CPU cooling program and the standard HSF, it's around 42.6 C. When I pushed it through some Prime95, it rose to 44.1, and hit 44.3 during 3DMark2001.
I know the PIII I'm using is rated for use up to 60 C, but I want to know at what temps they have begun to show instability in your experience.
Also, if I understand correctly, some of you guys sand off the blue finish on the die for better heat transfer, is that correct?
I have a better motherboard and a GlobalWin VOS32 on order, thanks to the helpful advice I've received in these forums, but I'd still like to experiment on this system in it's current state, and your data and input would be welcomed.
G
When I pulled the standard heatsink off the place the temp probe, I found a piece of white plastic tape was still on the heatsink over the CPU die! That was most likely my instability problem, preventing heat transfer. When I peeled it off, it left a piece of brown tape with an adhesive face, which must have been some sort of thermal tape for mounting a heatsink. I figured I could do without it and peeled it off, put on a dab of heatsink compund and remounted it, with the temp probe right next to, and touching, the die.
Idling in Win98SE, with no CPU cooling program and the standard HSF, it's around 42.6 C. When I pushed it through some Prime95, it rose to 44.1, and hit 44.3 during 3DMark2001.
I know the PIII I'm using is rated for use up to 60 C, but I want to know at what temps they have begun to show instability in your experience.
Also, if I understand correctly, some of you guys sand off the blue finish on the die for better heat transfer, is that correct?
I have a better motherboard and a GlobalWin VOS32 on order, thanks to the helpful advice I've received in these forums, but I'd still like to experiment on this system in it's current state, and your data and input would be welcomed.
G