Yes the 90nm chips are going to have similar heat to the Prescott, SOI is a better alternative to strained silicon, but the problem isn't with intel's process, it is basic to 90nm and the signal loss. There was a front page article on this, let me see if I can find it.
Yes the 90nm chips are going to have similar heat to the Prescott, SOI is a better alternative to strained silicon, but the problem isn't with intel's process, it is basic to 90nm and the signal loss. There was a front page article on this, let me see if I can find it.
x86-secret wrote that these 104W TDP ratings were found for current Socket 939 chips, which are 130nm. I wouldn't believe that x86-secret would get their hands on 90nm A64's before 130nm Socket 939 CPU's.
Well Intel does not have problems with 90 nm....Prescott have 3 times as many transistors if you compare to nortwood. So i don't think that going to 90nm will increse power consumption if you compare the 90nm part with an 130nm one....
Remember the AMD 90nm shrink is a clean shrink they aren't going to triple amount of trannies like Intel did.
Intel CPUs use VRDown design, their maximum voltage supplied decreases with increasing Amps. Prescott FMB 1.5 has under full load a voltage of aproximately 1.26V.
Intel datasheets give TDP that is typical power while executing publicly available software. TDP is not equal to Amps * Vcc therefore it is not maximum power CPU can dissipate under worst conditions. AMD give TDP as a maximum power under worst conditions. You can't simply compare Prescott's TDP to A64 TDP because those numbers are each telling different fact.
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