Hey guys - I know that there's already a thread based on this subject but it's degenerated into Apple cr*p / PC cr*p 
... so this isn't...
The new cooling system being touted for the new G5 http://www.amdzone.com/modules.php?...article&sid=687 appears to based around this technology www.cooligy.com
There are two really interesting pieces of technology here:
1) the Si based microchannel core - clearly they reckon that despite the poor conductivity of Si v. Cu the microchannel technology makes up for it and more [and from a thermal transfer point of view they're right - making the channels so thin that you lose the bad effect of the laminar boundary layer makes a load of sense] - obviously you can't lithographically etch Cu so they're stuck with Si.
2) the "electrokinetic" pump ... nice... No moving parts and silent. Presumably though it can't produce much of a flow rate -> hence the Si microchannel head must be damn efficient.
As an air cooling guy - what do you guys think? Anyone seen any more info / test results of this technology?
... so this isn't...The new cooling system being touted for the new G5 http://www.amdzone.com/modules.php?...article&sid=687 appears to based around this technology www.cooligy.com
There are two really interesting pieces of technology here:
1) the Si based microchannel core - clearly they reckon that despite the poor conductivity of Si v. Cu the microchannel technology makes up for it and more [and from a thermal transfer point of view they're right - making the channels so thin that you lose the bad effect of the laminar boundary layer makes a load of sense] - obviously you can't lithographically etch Cu so they're stuck with Si.
2) the "electrokinetic" pump ... nice... No moving parts and silent. Presumably though it can't produce much of a flow rate -> hence the Si microchannel head must be damn efficient.
As an air cooling guy - what do you guys think? Anyone seen any more info / test results of this technology?
