ok, what you are describing is a heat spreader. And actually the TEC only is over by about 2-3MM and Remmebering right, and now that I see how large 8MM is, this is obviously two large, I'll try going with a smaller plate, more aroun 2-3MM, which seemed to be great for similar wattage, which I had experienced 4 years ago with my brand new p3 600 coppermine's. I was able to test this on a couple of them, and worked great.
As far as the pressure I was at the max, to see the assembly, refer to previous post, I had attached a picture. I never measured how much pressure I had applied, but I think 300Lbs of it on small processor and computer like this is not advisable or realisticly possible. I could be wrong since I have not measured any of these attempts.
I was already at an more then ideal pressure. Actually I snapped one of the sockets and if I have the assembly attached, I am unable to post since not all pins are making contact and it is causing the post error. So now I am down to one processor now.
The motherboard I can not seem to find anywhere now, and Since I am between jobs I am out of the game and out near half the processing power of my machine.
I found part of the problem, some of the foam was laying under the peltier and was not perfectly aligned (I know, a novice mistake. In the haste, something that I had overlooked and is why I started asking for help.) I do and was posting temps of -10 idle for proc 1 and -4 for proc 2. Load was some where in 20's I think, High 20's. The cold plate may have helped.
Just in case,if anyone has a p3 Ghz processor (dual or not) , can you post up for comparsion. And would anyone know of somewhere that stocks the MSI (9105) Pro266TD Master-LR or know someone who has it for sale. Would be very helpful.
Well If I can not recieve this MSI board, I am looking at doing a Dual Xeon 1.7Ghz system in place. If anyone is interested in hearing further let me know, email or ICQ: 108-577-050