LGA775 3.0E/800Mhz build "Thermal Resistance"

[aforeign]

Hi, kinda of noob to this site, have a question I can't get answered. I built a SFF Shuttle XPC, 915 chipset, P4 LGA 775 3.0E/800mhz, 1GB XMS 400DDR, 6600GT PC-e, (hey had to save a little money) The Rig went together really well, and is running great. However when I run Sandra burn in, I am not reading in "CPU Cooling System Thermal Resistance" it just shows:
1. #J c/w (min1. #Jc/w, avg1. etc...
I am using the stock ice pipes from Shuttle, with the new screw in MOBO retainer. The CPU temps are stable at 31/c idle to about 45/c after 5 full cycles from sandra. Hit about 45/c after 15 minutes of U4 Tourny.

Any Suggestions?
Chris

[Mr. $T$]

I would not worry too much about that. For a prescott those are not bad temps with a shuttle. They have thermal switch that when the processor hits a preset temp the computer shuts down. Sounds like a great system hope you enjoy it.

[Xenocide]

hell thats better temps than i get on my stock heatsink

[Para]

Hmmmm.... i have a 3.2 LG775 running idle at 44 degrees C.........
Ive got a XP120 onit tooo.....ohwell seems like i need to rebuild it....