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New OCZ XTC Heatspreader!

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RedDragonXXX

RedDragonXXX

Senior RAM Pornographer
​
Joined
Mar 3, 2005
Location
Jacksonville, FL
OCZ Technology Group, a worldwide leader in innovative, ultra-high performance and high reliability memory, is extremely excited to announce the PC-3200 and PC-3500 Gold GX series modules which will be the first two products to utilize the latest OCZ heatspreader design. The new, patent-pending XTC (Xtreme Thermal Convection) Heatspreaders allow increased ventilation and heat dissipation due to an innovative honeycomb design providing more direct access to the actual memory ICs.

The unique design used in the XTC heatspreaders optimizes the thermal management of memory modules by promoting greater airflow by means of micro-convection throughout what is usually the dead air space inside conventional heatspreader designs. In this manner, build-up of heat is avoided and thermal dissipation of the memory components is offloaded more efficiently through the honeycomb design. At the same time, mechanical stability is maintained.

The PC-3200 and PC-3500 Gold Gamer eXtreme Series with 2-2-2-5 timings will be the first OCZ memory parts to include the new XTC heatspreader. The new Gold GX series modules are designed and qualified with special selection of premium components to maximize performance when playing even the most demanding graphics intensive games. With the addition of the new gold mirrored XTC heatspreader, the GX series in now better than ever.

The PC-3200 & PC-3500 Gold GX XTC series will be available in 512MB modules and 1GB (2x512) dual channel optimized kits. All OCZ memory solutions come backed with an industry-leading lifetime warranty and toll-free, direct technical support for unparalleled piece of mind!
Click to expand...






I definitely like the new idea as it will work great for those that are active cooling to allow more air to get in and out, but in that case why not just take the HS off :shrug:
 
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Looks great. I wonder if OCZ is going to use that 1/4 inch thick double sided tape to attach them to the ram modules? If they do, it'll be another waste as it will be all for the asthetics and not the function.

I remove the heatspreaders on most of my ram modules. That 1/4 in. thick white 3M tape they use to attach them acts more like insulation, and the heatspreaders act as the 2nd layer of insulation thus ensuring the heat stays trapped. I dunno who decided to call these things "heatspreaders" as they don't remove the heat at all. They should've been named "heat insulators" or Ram covers" instead, lol.
 
Yea those ventilation holes will prove useful, but I'm trying to figure out how is this better then just running without heat spreaders :shrug:

It does look nice though, but myself personally don't care about that since I'm after performance.

Would be nice to try these and see what they can do.
 
I'm with RedDragonXXX on this one. So they put a mesh to let the air in, then why not take the things off and let all the air in? This looks like it's another case of style over substance. I will be surprised if it turns out otherwise.
 
RedDragonXXX said:
I definitely like the new idea as it will work great for those that are active cooling to allow more air to get in and out.
Click to expand...

as stated, "ventilation" will never happen when they're using thermal tape. what else are they going to use?

on second though: let's say OCZ thermal epoxies those heatspreaders to the IC's. you have "ventilation" holes where air can pass through to the PCB where it goes no good. this heatspreader wont work better than any other (but we know they suck anyway). so bottom line it's all for looks (which is fine, don't get me wrong) so there's no need to discuss the cooling capabilities.
 
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crimedog said:
as stated, "ventilation" will never happen when they're using thermal tape. what else are they going to use?
Click to expand...

ME! said:
Yea those ventilation holes will prove useful, but I'm trying to figure out how is this better then just running without heat spreaders
Click to expand...

Just needed to gather my thoughts :p
 
Ooooooh dust should clog that up nicely in a few days :D

Crazy glue has about the same conductivity as some of those tapes, and it's about 1/5 as thick if your chips and spreader are flat. :D

I cut my own spreaders out of 3mm thick aluminum then clip or clamp them on with white goop underneath. Making your own also makes you study the fit very carefully so they don't bridge any of the little capacitors on some modules.

Hmmm I've got some aluminum window screen, I could make a CPU heatsink from it so the core gets some air.....

Road Warrior
 
Personally, I prefer heatcovers. You don't have to worry about static and more importantly, fatally scratching the DRAM chips. Dust could be an issue, but the ventilation provided could prove useful in cooling the PCB traces and SMT elements.
 
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