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New D975XBX2 Oct 7th.
- Thread starter ZGOZZ
- Start date
- Joined
- Nov 17, 2002
- Location
- Houston, TX
Now your just teasing us...
- Thread Starter
- #11
There is new ram coming out from corsair D line, nasty set of ram...
http://www.corsairmemory.com/corsair/dominator.html
The XMS2 DOMINATORTM DDR2 Performance Memory
The latest step in Corsair's ten year heritage of innovation in performance memory: we've redefined memory heat sink technology. And the result is unprecedented performance and reliability.
XMS2 DOMINATOR MODULES
PART NUMBER SPEED SIZE LATENCY ORGANIZATION FAN OTHER
TWIN2X2048-8500C5D XMS2-8500 2048MB 5-5-5-15-2T 2X240DIMM No EPP, SLI Certified
TWIN2X2048-8888C4DF XMS2-8888 2048MB 4-4-4-12-2T 2X240DIMM Yes EPP, SLI Certified
Protect Components While You Push Performance
Pushing performance specs generates heat, and that can compromise reliability and component life. The advanced cooling ability of Dual-path Heat Xchange (DHX) heat sinks keeps your memory safe and reliable even as you push it to the limit. Under the name XMS2 DOMINATOR, this DHX technology will be showing up on both Corsair parts designed for extreme overclocking and on memory designed for performance computing and gaming.
Why Performance DDR2 Memory Must Have Superior Heat Dissipation
Heat is the enemy of your computer's key components. Heat will slow down your system and impact long term reliability. And the more you tweak components for performance, the more heat is generated. With traditional DDR2 memory the standard method of chip packaging involves a BGA (Ball Grid Array). In a BGA, small balls of solder, organized as a grid, are the leads that connect the device to the module circuit board. The innovative first path is through the leads of the BGA chips into the printed circuit board (PCB). When BGA devices are soldered on to a memory module, an all-metal thermal path is created from the surface of the RAM to the copper ground plane of the PCB. This thermal path provides very efficient heat removal. In fact, a study by Micron Semiconductor (application note TN-00-08) indicated that well over half of the heat generated by a memory module is removed in this manner.
Corsair's Unique Dual-path Heat Xchange (DHX) Solves the Problem
Corsair's engineers have developed a unique design that maximizes heat dissipation, even in the most extremely overclocked DDR2 module. The results of recent benchmarks speak for themselves: A DOMINATOR heat sink assembly, using DHX technology and the addition of the Airflow fan, allowed a Corsair module to reach reliable performance at PC8888 or 1111MHz at CAS 4 settings.
DHX Technology uses two paths for the heat to escape from a memory module
1. Conventional dissipation through the front of the BGA chips into a pair of super efficient heat sinks
2. Additional dissipation through the back of the BGA devices and through the circuit board.
Forced airflow further enhances the performance of the module
Optional DOMINATOR Airflow Fan Boosts Cooling Ability Even More
If you are really planning to push the envelope, choose a DOMINATOR module that includes the optional Airflow fan.
All Modules Feature Enhanced Performance Profiles (EPP)
Corsair and NVIDIA have jointly developed a new open standard that enhanced the Serial Presence Detect (SPD). This exciting new development simplifies the overclocking process while ensuring platform and component compatibility. EPP compatible motherboards can access and take advantage of added performance capability and information. The result: simplified overclocking for beginners and unparalleled control for experts. All XMS2 DOMINATOR modules feature EPP.
http://www.corsairmemory.com/corsair/dominator.html
The XMS2 DOMINATORTM DDR2 Performance Memory
The latest step in Corsair's ten year heritage of innovation in performance memory: we've redefined memory heat sink technology. And the result is unprecedented performance and reliability.
XMS2 DOMINATOR MODULES
PART NUMBER SPEED SIZE LATENCY ORGANIZATION FAN OTHER
TWIN2X2048-8500C5D XMS2-8500 2048MB 5-5-5-15-2T 2X240DIMM No EPP, SLI Certified
TWIN2X2048-8888C4DF XMS2-8888 2048MB 4-4-4-12-2T 2X240DIMM Yes EPP, SLI Certified
Protect Components While You Push Performance
Pushing performance specs generates heat, and that can compromise reliability and component life. The advanced cooling ability of Dual-path Heat Xchange (DHX) heat sinks keeps your memory safe and reliable even as you push it to the limit. Under the name XMS2 DOMINATOR, this DHX technology will be showing up on both Corsair parts designed for extreme overclocking and on memory designed for performance computing and gaming.
Why Performance DDR2 Memory Must Have Superior Heat Dissipation
Heat is the enemy of your computer's key components. Heat will slow down your system and impact long term reliability. And the more you tweak components for performance, the more heat is generated. With traditional DDR2 memory the standard method of chip packaging involves a BGA (Ball Grid Array). In a BGA, small balls of solder, organized as a grid, are the leads that connect the device to the module circuit board. The innovative first path is through the leads of the BGA chips into the printed circuit board (PCB). When BGA devices are soldered on to a memory module, an all-metal thermal path is created from the surface of the RAM to the copper ground plane of the PCB. This thermal path provides very efficient heat removal. In fact, a study by Micron Semiconductor (application note TN-00-08) indicated that well over half of the heat generated by a memory module is removed in this manner.
Corsair's Unique Dual-path Heat Xchange (DHX) Solves the Problem
Corsair's engineers have developed a unique design that maximizes heat dissipation, even in the most extremely overclocked DDR2 module. The results of recent benchmarks speak for themselves: A DOMINATOR heat sink assembly, using DHX technology and the addition of the Airflow fan, allowed a Corsair module to reach reliable performance at PC8888 or 1111MHz at CAS 4 settings.
DHX Technology uses two paths for the heat to escape from a memory module
1. Conventional dissipation through the front of the BGA chips into a pair of super efficient heat sinks
2. Additional dissipation through the back of the BGA devices and through the circuit board.
Forced airflow further enhances the performance of the module
Optional DOMINATOR Airflow Fan Boosts Cooling Ability Even More
If you are really planning to push the envelope, choose a DOMINATOR module that includes the optional Airflow fan.
All Modules Feature Enhanced Performance Profiles (EPP)
Corsair and NVIDIA have jointly developed a new open standard that enhanced the Serial Presence Detect (SPD). This exciting new development simplifies the overclocking process while ensuring platform and component compatibility. EPP compatible motherboards can access and take advantage of added performance capability and information. The result: simplified overclocking for beginners and unparalleled control for experts. All XMS2 DOMINATOR modules feature EPP.
ZGOZZ said:
SimbaLion Welcome to the forum
Something is not right, I call my Intel rep waiting to hear from him....
Thanks for the welcome (even though I got welcomed a few posts up...
)I am eagerly awaiting any news. It's unbearable just having all the hardware sitting around except for a mobo. I might jump on something if the wait is any longer.
- Joined
- Nov 17, 2002
- Location
- Houston, TX
- Joined
- Oct 9, 2004
- Location
- Asheville NC
I'm impressed. Clearly Intel has wised up and is catering to enthusiast. 433FSB, if it can do it stable, is more them my P5W DH does.... It's an attractive board.
![[H]pututu](/forums/data/avatars/s/241/241673.jpg?1704411343){kind=avatar}
