Rick G
12-12-01, 08:26 PM
I'm still waiting for my Alpha P3125 to arrive, but thought I should do the homework on thermal compound application. I've read that it should be almost non-existent...used only as a microscopic filler for surface imperfections. But then I've also read that it should be about the thickness of a piece of paper.
I'm assuming most would prefer Arctic Silver II over that which comes with the HSF kit. But I was wondering what the conventional wisdom is regarding thickness of material spread over the cpu and HS.
Any thoughts/tips would be appreciated.
I'm assuming most would prefer Arctic Silver II over that which comes with the HSF kit. But I was wondering what the conventional wisdom is regarding thickness of material spread over the cpu and HS.
Any thoughts/tips would be appreciated.