CNet's Buzz Report Goes On About Inquirer Chip Scandal

[AngelfireUk83]

http://cnettv.cnet.com/2001-1_53-50004762.html?tag=nl.e404

It's going on again the so chip scandal and this time CNETs buzz report seems to maybe back it up must do if there reporting it.
On other news check out the vid with that hovering machine gun missle firing thing what the..... and mario at the end was crazy but funny.

[torin3]

Wow...kind of a snarky reporter there. Also, the reporter completely misunderstood what the gadget is. It is supposed to be launched on a missle, and will have quite a bit of forward momentum. This is just a test to see how well they can track and control it's lateral movements. And no machineguns on it, those were thrusters.

[jivetrky]

OK, so that thing at the beginning.... Was that a REAL thing or was that rendered in a video game engine? My eyes couldn't figure it out either way.


EDIT: Oh, also... if it was real, awesome. If it was rendered, awesome to the 3D engine. :)

[ViperJohn]

If it wasn't bad enough that Charlie keeps spewing his gross conclusion jumping crap now CNET is parroting it. I bet Charlie gets an even bigger kick back from ATI for pulling that one off lol.

What is really bad is Charlie's last article on the new MacBook Pro's was complete and utter crap. He was saying that because a high lead bump was used that automatically makes it bad and that is absolute BS. It is a combination of the bump material and the under fill used that may create a problem and that goes with ANY chip packaging of this type be it made with high lead or Eutectic bumps. The two bumps have different thermal expansion/contraction characteristics and the under fill has to match the bump used.

Up until about 12-18 months ago all GPU's, CPU's, Chipsets, etc that used this type of packaging were all made with high lead bumps. Many are still made with high lead bumps including AMD's A64 CPU's. High lead bumps are proven reliable and have been for 10 years.

Just because high lead bumps, in and of themselves, are used in no way implies a defective process or chip except in the mind of Charlie. If their use was bad our GPU's, CPU's and Chipset would have been dying en mass for years. If Charlie had found Eutectic bumps I guess he would have been blissfully and ignorantly at peace even though if the wrong under fill was used with Eutectic bumps you could have a massive problem too. That was found out big time in 2006 when Eutectic bumps were first starting to be used.

It has only been in the last 12-18 months or so that Eutectic bumps have really started to phased into desktop computer targeted parts. Their use has downsides and upsides with the biggest upside being they are lead free hence able to be used in RoHS compliant parts but their use in no way insures you will not have a problem part either.

Viper