3ldon
01-04-10, 03:59 AM
I've been looking at building a new system, so I've been debating how appropriate is it right now to build a system to handle a grossly over-clocked processor. (I have not decided what to go with yet.)
What I've found is there is a lot of data available on 50+ websites detailing the performance of various water blocks, heat sinks, radiators etc.
What i don't like is the price, I'm not about to spend $50 on a water block, $100 on a radiator and $40 on a water pump when i could hack together a system that works just as well for less.
Having said that lets take a look at some heat-sinks, we have generally speaking, 6, 8 and 10 heat pipe designs, all with various flow rates and fin area.
(6 pipes means 6 pipes leave the processor, i'm intentionally ignoring the fact that there may be 3 dual, or 6 separate pipes....)
If you look on frosty tech, the top 5 are all the same design, heat pipes in direct contact with the processor. and they all offer the same 15C temp rise at 150 watts heat or .1C/watt, regardless whether or not they have 8 or 10 heat pipes.
A quick look at what Newegg has available on the cheap, only one currently has exposed heat pipes, the Xigmatic S1283V; frosty places it at 18C/150W, it is a 6 heat pipe design! The rest are 6/8 heat-pipes, soldered into a drilled copper block, or nickel plated aluminum...and they vary between 23 and 28C/150 watt.
What this shows us with is that the heat pipe isn't the limiting factor, its the heat pipe to processor contact, and fin area.
Example:
If we take a 30mm cube of copper and apply 150 watts of heat to one side and an infinite heat sink to the other, it is trivial to see that there will be a 12C difference across it, and the same math for a 2.5 mm thick spreader that the heat-pipes are soldered to is an additional 1C just for the copper alone.
Looking at water blocks, considering that most of them have at least a 2 mm thick base, you can't possibly get better than .01C/watt;
(the APOGEE GT is at .06 to .04C/watt at .5 to 3 gpm)
What I want to discuss here is that it appears that pumping acetone through the existing heat pipes on a Xigmatic S1283V is going to get you better performance than a $60 waterblock, and it offers you a .12C/watt heat-sink for free. (Water is just too viscous to get inside the wick structure, assuming the heat pipes aren't using water to start with, (if they are then acetone will not be that much of an improvement)) This statement is based on the assumption that the thermal resistance is .03C/watt from processor to heat pipe, and .07C/watt from heat pipe to air. The thermal resistance of the heat pipes is almost negligible at .01C/watt.
Reading reviews of 70C core temperatures even with a water block, the thought occurs to me, why not seal off all the way around the processor with silicon and pump acetone underneath it as well?
The thermal conductivity of silicon leaves much to be desired.
What I've found is there is a lot of data available on 50+ websites detailing the performance of various water blocks, heat sinks, radiators etc.
What i don't like is the price, I'm not about to spend $50 on a water block, $100 on a radiator and $40 on a water pump when i could hack together a system that works just as well for less.
Having said that lets take a look at some heat-sinks, we have generally speaking, 6, 8 and 10 heat pipe designs, all with various flow rates and fin area.
(6 pipes means 6 pipes leave the processor, i'm intentionally ignoring the fact that there may be 3 dual, or 6 separate pipes....)
If you look on frosty tech, the top 5 are all the same design, heat pipes in direct contact with the processor. and they all offer the same 15C temp rise at 150 watts heat or .1C/watt, regardless whether or not they have 8 or 10 heat pipes.
A quick look at what Newegg has available on the cheap, only one currently has exposed heat pipes, the Xigmatic S1283V; frosty places it at 18C/150W, it is a 6 heat pipe design! The rest are 6/8 heat-pipes, soldered into a drilled copper block, or nickel plated aluminum...and they vary between 23 and 28C/150 watt.
What this shows us with is that the heat pipe isn't the limiting factor, its the heat pipe to processor contact, and fin area.
Example:
If we take a 30mm cube of copper and apply 150 watts of heat to one side and an infinite heat sink to the other, it is trivial to see that there will be a 12C difference across it, and the same math for a 2.5 mm thick spreader that the heat-pipes are soldered to is an additional 1C just for the copper alone.
Looking at water blocks, considering that most of them have at least a 2 mm thick base, you can't possibly get better than .01C/watt;
(the APOGEE GT is at .06 to .04C/watt at .5 to 3 gpm)
What I want to discuss here is that it appears that pumping acetone through the existing heat pipes on a Xigmatic S1283V is going to get you better performance than a $60 waterblock, and it offers you a .12C/watt heat-sink for free. (Water is just too viscous to get inside the wick structure, assuming the heat pipes aren't using water to start with, (if they are then acetone will not be that much of an improvement)) This statement is based on the assumption that the thermal resistance is .03C/watt from processor to heat pipe, and .07C/watt from heat pipe to air. The thermal resistance of the heat pipes is almost negligible at .01C/watt.
Reading reviews of 70C core temperatures even with a water block, the thought occurs to me, why not seal off all the way around the processor with silicon and pump acetone underneath it as well?
The thermal conductivity of silicon leaves much to be desired.