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Thats incorrect IB at 4.8GHz oc is 277 watts load and stock it's 134W load. My SB at 4.8GHz is 233 watts.
I have to ask, knowing what Z77 brings to the table, what would compel you to get rid of your current board?fall said:I think i will stick with my 2600k for the mean time and just get a Z77 board
Well, the problem is you are comparing two different systems... mobo's, ram, hdd, etc. So though it may not make up the difference, its tough to compare non like systems and come to a conclusion. That and, he mentioned stock you go to overclocked to prove your point... LOL!Thats incorrect IB at 4.8GHz oc is 277 watts load and stock it's 134W load. My SB at 4.8GHz is 233 watts.
Eh? how will this chip cool your room down XD. If anything your rads are going to giving off alot more heat!
so if Intel actually sorted out the heat transfer between the actual chip/ lid the heat issues wouldnt be anywhere near as bad?
We don't know yet how they are adhering the heatspreader to the chip. They could be using the soldering method they've used on more recent chips, or they may have gone back to a more traditional TIM. The only picture I've seen of a delidded IB chip did not appear to be soldered on... If it isn't soldered, part of the temperature problem when overclocked is VERY LIKELY due to the interface between IHS and die.
so if Intel actually sorted out the heat transfer between the actual chip/ lid the heat issues wouldnt be anywhere near as bad? Or is it down to the cip being so much smaller?
sorry for the crude questions. Its just its weird to think that a processor roasting at 80+ c would give off less heat than the 50c processor. But as it was mentioned IB uses even more W's when OC'd. Slightly cofused
Ah ok bad bonj. Thought you were on the Sb for some reason :S
I have to ask, knowing what Z77 brings to the table, what would compel you to get rid of your current board?
Power density is exactly what I was thinking! It's funny how technology repeats itself.Yeah, I agree wholeheartedly with I.M.O.G. about this. If they aren't doing the flusless bonding process between the IHS and processor die, then you will have severe problems getting the heat to transfer to the heatsink because the traditional (and old fashioned and cheap) TIM process is much less efficient. I have also seen that several reviews have given the processor die a size of 160 mm² as compared to the SB having a die size of 216 mm². If Intel is still actually using the fluxless soldering bonding process, then we are seeing power density problems such as Intel started having back in the day of single core P4 days.
I'd say a Noctua NH-D14 would be great on these if you want a solid air cooler. If you want water, I'd get something with a dual radiator (H100), custom water loop or not waste your time with water. The single-rad coolers are, for the most part, no better than you can get with a top-end air cooler.
Got my answer back from Intel... It isn't solder or TIM!
It is, and I quote, "secret sauce".
I urge you to go out and hound anyone with a dead Ivy Bridge, get them to delid (if its already dead a hammer and a screwdriver works well), and please report back with the findings... I'll write you personalized and deeply heartfelt love letters if your findings also include pictures posted here.
Got my answer back from Intel... It isn't solder or TIM!
It is, and I quote, "secret sauce".
I urge you to go out and hound anyone with a dead Ivy Bridge, get them to delid (if its already dead a hammer and a screwdriver works well), and please report back with the findings... I'll write you personalized and deeply heartfelt love letters if your findings also include pictures posted here.