I'm having hella heat probs w/my IC7-G 3.4 XP90 rig
Plans for beating my deadspot: 1 or 2 TT ducts and 80MM Tornado!
angled to force air into the center of the XP90.
My s*** is heating up now more since its now getting to be >70F***** degrees. I recently got a new set of killer RAM and its OC'ing well, but I'm observing some pretty wierd shtuff after having lapped my XP90 and the VF700 CU I have put on my GF6800 Ultra to replace my stock cooler. Prior to the heat increase of the past few days I'd noticed that before I removed the nickel from the XP90 (lapped using pcviper.net's kit) and used the last polishing compound on the VF700cu before mounting the sinks, in thier original form both load temperatures for CPU and for GPU were reporting at least 2 degrees C cooler.
This being my first lapping job, I was surprised at the finish the kit left on the bottom of the sink, as it was as described; a shiny high polished flat finish on the contact spot. I used a thin layer of AS 5 as described at PCviper.net and left a tiny bead in the center for spread out. When sink applied, I twisted a few degrees each way to get the contact spot covered, and locked it down.
The mobo is reporting the temperatures high I as understand it, but I don't know how high and what temperatures I should'nt be crossing even when taking the 5-7 degrees or so into account. With my new set of OCZ Plat Rev2 PC3200, I was able to manage 215 X 17 for 3655 @ 1:1 2-2-2-5 GAT: A:A:A
Bios R27, board copper sinked. The CPU is was reading ~64.5C at load until yetserday when it was going up to 66.5C.
The system temperature also obviously was greater than it was a week ago too; jumped from ~26-29C to 31~33C. I don't have any board mods except for copper sinking mosfets and North Bridge w/ NB1Cu. I haven't completed the top of my custom acrylic case yet so some of the air is slightly stagnant, but the majority of it is fresh coming in from the window above it.