- Joined
- Nov 12, 2002
- Location
- Rootstown, OH
In the recent past, Intel has been using an fluxless soldering method between CPU die and IHS. The soldering method they use(d) is patented, and described generally here:
http://www.google.com/patents/US7009289?printsec=description#v=onepage&q&f=false
Someone with a dead Ivy Bridge delidded and took a picture, stating nothing about a soldered connection, but only TIM between core and IHS:
Is anyone else delidding already, or has anyone else seen evidence of the thermal interface between die and IHS on Ivy Bridge?
The suspicion we have been discussing in light of higher heat levels being reported with Ivy Bridge, is that they haven't been using the fluxless soldering method to ensure a more solid bond between die and IHS, so while Intel claims the increased heat is due to transistor density... There may be other variables at play as well.
Anyone else with thoughts or references? Also, when you get your IB and delid it - post here.
http://www.google.com/patents/US7009289?printsec=description#v=onepage&q&f=false
Someone with a dead Ivy Bridge delidded and took a picture, stating nothing about a soldered connection, but only TIM between core and IHS:
Is anyone else delidding already, or has anyone else seen evidence of the thermal interface between die and IHS on Ivy Bridge?
The suspicion we have been discussing in light of higher heat levels being reported with Ivy Bridge, is that they haven't been using the fluxless soldering method to ensure a more solid bond between die and IHS, so while Intel claims the increased heat is due to transistor density... There may be other variables at play as well.
Anyone else with thoughts or references? Also, when you get your IB and delid it - post here.