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  1. #61
    Robert17's Avatar
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    This editorial got linked on The TechReport:

    http://techreport.com/discussions.x/22855

    Overclockers.com editorial: Ivy Bridge temperatures—it's gettin' hot in here
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  2. #62
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    Quote Originally Posted by hokiealumnus View Post
    Just for reference, here is what a soldered die looks like de-lidded.

    Name:  sb-die.jpg
Views: 199
Size:  47.7 KB

    Image courtesy BlindFreddie @ XS.
    ....and this is what happens if you don't take a soldered IHS off properly (image found @ OCN).

    Name:  bobble-soldered-die.jpeg
Views: 767
Size:  202.3 KB

    Here's a soldered IHS removal guide.

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  3. #63
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    Sorry for double-posting, but this is worth it - Non-soldered IHS has been verified by Shamino (of ASUS RoG team fame).

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  4. #64
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    I'm very disappointed that Intel does this to us.
    I also feel anger towards Intel.

  5. #65
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    Yep, Sandy Bridge was soldered - Reference.

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  6. #66
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    http://muropaketti.com/artikkelit/pr...k-ivy-bridge,7

    They tested a 3770K (ES version) and a 3550K (retail version) and there was a clear temperature difference between the two.

    3770K http://plaza.fi/s/f/editor/attachments/3770k_oc.png

    3570K http://plaza.fi/s/f/editor/attachments/3570k_oc.png

    They're not the same CPU, so I don't know how comparable these results are, but the retail 3570K ran much cooler than the ES 3770K. They were both air-cooled with a Noctua NH-D14 and both were running at about the same voltage and clocks.
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  7. #67
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    I sure hope so, one has HT and one does not. BIG difference there.

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  8. #68
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    I hope that intel either sticks with it, or changes to solder before release. Either we need to be able to COUNT on being able to delid chips, or not have to.

    Also, I've got tons of experience with delidding and using direct die stuff. I can manage. ^_^

    Common sense says they have to fix it though. Think about it, people will just buy 2600k's instead of 3770k's because in the end they're faster. O.o
    Last edited by Aynjell; 04-26-12 at 10:07 AM.
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  9. #69
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    there is also a 100mhz cpu difference speed wise as clocked. 3550 was at 4600 and the 3770 was at 4700
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  10. #70
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    De-lid Ivy >> change Thermal Compound (not worth it)

    If anyone is thinking about deliding there Ivy and replacing the Thermal Compound with something expensive off the shelve don't take the chance..... its been done here
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  11. #71
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    Well ya, expecting hundreds or even a ghz more from this is plain silly.
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  12. #72
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    Quote Originally Posted by Eldonko View Post
    Well ya, expecting hundreds or even a ghz more from this is plain silly.
    I don't think he was expecting that, he was trying to get temps that are more sandy than ivy at high clocks
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  13. #73
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    http://forums.anandtech.com/showthread.php?p=33347200

    shows the temps of a retail 3770k
    "4.5 ghz 1.200 V at load (2nd highest LLC on gigabyte UD5H), ~20C idle, 72/75/76/71
    testing now at 4.6 on same volts. 1 hour in and hottest core at 76
    @4.8 83C"


    Seems like it does use TIM and therefore shammy@asus's suggestion of changing the TIM to something thicker and filing the IHS feet down would help significantly.

  14. #74
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    So who has their retail IvyB? Earth, did yours come from china yet? anyone remove the IHS on a retail chip?
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  15. #75
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    I was joking in ordering that from ebay. And yes, it was linked in here already that a retail chip has been delided and shows the same TIM. Post # 63.

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  16. #76
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    THAT looks much much better...
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  17. #77
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    hokie went in that thread and pointed out that the cooling wasn't meant for that configuration... pressure change on the chip is much different.

    Also the water bock would need to concentrate water differently for a smaller chip.
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  19. #78
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    This would have been great in the already created thread about IB and deliding... even though the premise of this thread was bunked just a couple posts below in the provided link.

    Delete now?
    Last edited by EarthDog; 04-26-12 at 11:38 AM.

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  20. #79
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    great post over at kingpin Hokie; hopefully the OC.c team can at least collectively give intel some crap about this and I'm personally hoping for revisions within the next batch of IB chips. lucky for me, rent is due and I won't have $$ till mid May; so i can see how this plays out. @earth, darn...
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  21. #80
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    Reading some reviews and all the posts here has had my head spinning. Out of the spin, I'm wondering if there is something inherent in the new lithography, i.e., tri-gate 3D, that makes the use of solder in attaching the IHS to the CPU a difficult proposition. I've linked a Wiki entry for soldering for generic review and consideration. Embrittlement using RoHS compliant solders may be an issue, solder temps not so much due to the availability of several RoHS compliant solder choices. And there is mention of several more exotic 4-metal solders available, all leading me to think that if cost isn't an issue, solder availability isn't an issue, and the major change in the whole bonding equation is the lithography, the engineers found some hard-to-resolve bonding issues.

    http://en.wikipedia.org/wiki/Solder
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