- Joined
- Feb 26, 2004
As some of you may know, I've got this thing about RAM. To me (and many other like-minded enthusiasts), the most important factor in buying memory is knowing what memory chips are under the hood. If you know what is under the spreader of a particular product then you can better determine if that product will fit your particular needs.
Unfortunately, there isn't a single place that we can go to find out what memory chips are being used on a particular product so you have to know how to read module labels, or look at other available information in order to make an educated guess. Since I’m often asked where I go to get information I decided to make this thread and list my sources & methods for guessing.
In addition, I would encourage other members to chime in and augment this list with their sources. I know that here on OCF there is a large group of guys / gals that already have a pretty good handle on this stuff so by collaborating we ought to be able to put something together that would be worthwhile and in turn would benefit those members that have not had the opportunity to learn how to gather this info.
Most of these links are for DDR3, although the ram list below also covers DDR & DDR2. I personally haven’t moved into DDR4 so others will have to have to take the lead with the newest stuff.
Enough with the introductions, let’s get started.
One of the best places to start is linked below. You can find info on DDR1-DDR3, by manufacturer. Note that often the same memory chips are being used by the different manufacturers at around the same time so if a specific brand/model isn't listed, look for one with similar speeds/timings/voltage from the other guys and you can probably figure out what's under the lid of the kit that you are interested in.
http://ramlist.i4memory.com/
Related thread (member submissions, often with IC pictures):
http://i4memory.com/showthread.php?t=8426
G.Skill:
The best source that I’m aware of for coding information included in the G.Skill Serial Numbers can be found here:
http://www.xtremesystems.org/forums/showthread.php?283666-Figuring-out-G-Skill-s-SNs
Below is a related post that I made responding to information that was posted by member Sam OCX at OCN (known elsewhere as TaPaKaH). It discusses how to differentiate between the DDR3-1333 and DDR3-1600 rated versions of ICs and is also useful in distinguishing between ICs on single-sided vs double-sided modules. The actual posts are copied below.
First is a copy of the post made by TaPaKaH (as Sam OCX) in the OCN Ram Addict Thread recapping GSkill’s distinction between DDR3-1333 and DDR3-1600 rated chips
“My current guess is that 1400/1500 means that ICs have 1333 9-9-9 JEDEC bin and 2400/2500 is they have 1600 11-11-11 JEDEC bin. Either way, these are clearly dual-sided (looking at the caps) so must be CFR ... now luke, tell us how these clock
By the way, "4GTXD" in SPD is not special - if you look back all the way up to DDR1 - GSKill use module capacity rather than kit capacity there.”
Then my follow up comments:
“That's an interesting take and you may be right. That would fit the pattern with Samsung, as well. The HCH9, a 1333 part was being shipped with the S/N "1500" in those 2400 C9 kits and the HYK0, a 1600 bin was being shipped with the "2500" S/N.
Following that logic then, a 2x8GB kit of Hynix based MFR PBC would have a S/N with a "2400" in it, but one made using the older MFR H9C (if used) would sport a "1400". Would you agree?
http://www.hynix.com/products/compu...nfo.serialNo=H5TQ4G83MFR&posMap=computingDDR3
Over at XS there was a pic posted of the ICs of one of these 2666 C11 kits with the "1400" and it was in fact CFR H9C (a 1333 part if I'm reading the info from the Hynix site correctly).
http://www.xtremesystems.org/forums...2666-Preview&p=5153644&viewfull=1#post5153644
Therefore, a 2x4 double sided kit with Hynix timings and sporting the "2400" number should be expected to be using CFR PBC...a 1600 bin part?
http://www.hynix.com/products/compu...nfo.serialNo=H5TQ2G83CFR&posMap=computingDDR3
So if you know whether it is a single-sided, or a double-sided module, then based on whether you are looking at a 2x4GB kit, or a 2x8GB kit and whether it has the 1400/2400 for Hynix or the 1500/2500 for Samsung, you have a pretty good chance of guessing what is under the hood.
Does this look right?
For 4GB modules:
single-sided 1400 = MFR H9C (1333 part)
double-sided 1400 = CFR H9C (1333 part)
double-sided 2400 = CFR PBC (1600 part)
single-sided 1500 = the Samsung 4Gbit HCH9 (1333 part)
double-sided 1500 = the Samsung 2Gbit HCH9 (1333 part)
double-sided 2500 = HYK0 (1600 part)
for 8GB modules:
double-sided 1400 = MFR H9C (1333 part)
double-sided 2400 = MFR PBC (1600 part)
double-sided 1500 = the Samsung 4Gbit HCH9 (1333 part)
double-sided 2500 = ??? (I don't know it)
There is also a Hynix AFR that I've gotten on some generic 8GB modules and it is like MFR so it is possible to get these instead of MFR.
http://www.hynix.com/products/compu...nfo.serialNo=H5TQ4G63AFR&posMap=computingDDR3
There are also some Samsung variants to HCH9 that have popped up from time to time, so there are no guarantees, but generally speaking, most Hynix based stufft these days seems to be either CFR or MFR, and most Samsung would be either HCH9 (2Gbit or 4Gbit) or HYK0.”
Source for above post:
http://www.overclock.net/t/1268061/ocn-ram-addict-club-gallery/1880_40#post_20158789
BTW, that Ram Addict Club / Gallery thread linked above is also a great source of info...you just have to pull it out in bits & pieces.
Corsair:
Corsair uses the "verx.xx" number on their module labels to identify the IC used. I’ll elaborate on this with some examples in the near future.
http://forum.corsair.com/forums/showthread.php?t=68811
Kingston:
Coding info on the labels...this info is also a partial quote from TaPaKaH which was posted on XS.
“Basic technique goes as follows: vertical code on the stickers.
symbol 4 is IC maker: E for Elpida, H for Hynix, M for Micron, N for Nanya, S for Samsung, K for random.
symbols 5-6 are # of ICs: 08 is single-sided, 16 is dual-sided.
symbol 7 is production month: 1-9, A, B, C.
symbols 8-9 is production year.”
Source (post #518 dated 04-21-14):
http://www.xtremesystems.org/forums/showthread.php?285750-Interesting-memory-deals-thread&p=5230258&viewfull=1#post5230258
General Info:
Some very useful information in another thread started by TaPaKaH over at XS which is loaded with detail about the various DDR3 memory chips and includes overclocking attributes about many of them:
http://www.xtremesystems.org/forums/showthread.php?285767-DDR3-IC-thread
That’s all I’ve got for now. Please feel free to add your own sources or insight on how you identify the memory in your modules. Please note that this thread isn't intended as a list of what current or past products have what chips, but instead as a "how to" read the labels and use other available information to identify the actual chips, or most likely chips being used in a module.
Unfortunately, there isn't a single place that we can go to find out what memory chips are being used on a particular product so you have to know how to read module labels, or look at other available information in order to make an educated guess. Since I’m often asked where I go to get information I decided to make this thread and list my sources & methods for guessing.
In addition, I would encourage other members to chime in and augment this list with their sources. I know that here on OCF there is a large group of guys / gals that already have a pretty good handle on this stuff so by collaborating we ought to be able to put something together that would be worthwhile and in turn would benefit those members that have not had the opportunity to learn how to gather this info.
Enough with the introductions, let’s get started.
One of the best places to start is linked below. You can find info on DDR1-DDR3, by manufacturer. Note that often the same memory chips are being used by the different manufacturers at around the same time so if a specific brand/model isn't listed, look for one with similar speeds/timings/voltage from the other guys and you can probably figure out what's under the lid of the kit that you are interested in.
http://ramlist.i4memory.com/
Related thread (member submissions, often with IC pictures):
http://i4memory.com/showthread.php?t=8426
G.Skill:
The best source that I’m aware of for coding information included in the G.Skill Serial Numbers can be found here:
http://www.xtremesystems.org/forums/showthread.php?283666-Figuring-out-G-Skill-s-SNs
Below is a related post that I made responding to information that was posted by member Sam OCX at OCN (known elsewhere as TaPaKaH). It discusses how to differentiate between the DDR3-1333 and DDR3-1600 rated versions of ICs and is also useful in distinguishing between ICs on single-sided vs double-sided modules. The actual posts are copied below.
First is a copy of the post made by TaPaKaH (as Sam OCX) in the OCN Ram Addict Thread recapping GSkill’s distinction between DDR3-1333 and DDR3-1600 rated chips
“My current guess is that 1400/1500 means that ICs have 1333 9-9-9 JEDEC bin and 2400/2500 is they have 1600 11-11-11 JEDEC bin. Either way, these are clearly dual-sided (looking at the caps) so must be CFR ... now luke, tell us how these clock
By the way, "4GTXD" in SPD is not special - if you look back all the way up to DDR1 - GSKill use module capacity rather than kit capacity there.”
Then my follow up comments:
“That's an interesting take and you may be right. That would fit the pattern with Samsung, as well. The HCH9, a 1333 part was being shipped with the S/N "1500" in those 2400 C9 kits and the HYK0, a 1600 bin was being shipped with the "2500" S/N.
Following that logic then, a 2x8GB kit of Hynix based MFR PBC would have a S/N with a "2400" in it, but one made using the older MFR H9C (if used) would sport a "1400". Would you agree?
http://www.hynix.com/products/compu...nfo.serialNo=H5TQ4G83MFR&posMap=computingDDR3
Over at XS there was a pic posted of the ICs of one of these 2666 C11 kits with the "1400" and it was in fact CFR H9C (a 1333 part if I'm reading the info from the Hynix site correctly).
http://www.xtremesystems.org/forums...2666-Preview&p=5153644&viewfull=1#post5153644
Therefore, a 2x4 double sided kit with Hynix timings and sporting the "2400" number should be expected to be using CFR PBC...a 1600 bin part?
http://www.hynix.com/products/compu...nfo.serialNo=H5TQ2G83CFR&posMap=computingDDR3
So if you know whether it is a single-sided, or a double-sided module, then based on whether you are looking at a 2x4GB kit, or a 2x8GB kit and whether it has the 1400/2400 for Hynix or the 1500/2500 for Samsung, you have a pretty good chance of guessing what is under the hood.
Does this look right?
For 4GB modules:
single-sided 1400 = MFR H9C (1333 part)
double-sided 1400 = CFR H9C (1333 part)
double-sided 2400 = CFR PBC (1600 part)
single-sided 1500 = the Samsung 4Gbit HCH9 (1333 part)
double-sided 1500 = the Samsung 2Gbit HCH9 (1333 part)
double-sided 2500 = HYK0 (1600 part)
for 8GB modules:
double-sided 1400 = MFR H9C (1333 part)
double-sided 2400 = MFR PBC (1600 part)
double-sided 1500 = the Samsung 4Gbit HCH9 (1333 part)
double-sided 2500 = ??? (I don't know it)
There is also a Hynix AFR that I've gotten on some generic 8GB modules and it is like MFR so it is possible to get these instead of MFR.
http://www.hynix.com/products/compu...nfo.serialNo=H5TQ4G63AFR&posMap=computingDDR3
There are also some Samsung variants to HCH9 that have popped up from time to time, so there are no guarantees, but generally speaking, most Hynix based stufft these days seems to be either CFR or MFR, and most Samsung would be either HCH9 (2Gbit or 4Gbit) or HYK0.”
Source for above post:
http://www.overclock.net/t/1268061/ocn-ram-addict-club-gallery/1880_40#post_20158789
BTW, that Ram Addict Club / Gallery thread linked above is also a great source of info...you just have to pull it out in bits & pieces.
Corsair:
Corsair uses the "verx.xx" number on their module labels to identify the IC used. I’ll elaborate on this with some examples in the near future.
http://forum.corsair.com/forums/showthread.php?t=68811
Kingston:
Coding info on the labels...this info is also a partial quote from TaPaKaH which was posted on XS.
“Basic technique goes as follows: vertical code on the stickers.
symbol 4 is IC maker: E for Elpida, H for Hynix, M for Micron, N for Nanya, S for Samsung, K for random.
symbols 5-6 are # of ICs: 08 is single-sided, 16 is dual-sided.
symbol 7 is production month: 1-9, A, B, C.
symbols 8-9 is production year.”
Source (post #518 dated 04-21-14):
http://www.xtremesystems.org/forums/showthread.php?285750-Interesting-memory-deals-thread&p=5230258&viewfull=1#post5230258
General Info:
Some very useful information in another thread started by TaPaKaH over at XS which is loaded with detail about the various DDR3 memory chips and includes overclocking attributes about many of them:
http://www.xtremesystems.org/forums/showthread.php?285767-DDR3-IC-thread
That’s all I’ve got for now. Please feel free to add your own sources or insight on how you identify the memory in your modules. Please note that this thread isn't intended as a list of what current or past products have what chips, but instead as a "how to" read the labels and use other available information to identify the actual chips, or most likely chips being used in a module.
Last edited:
to you Reefa for starting this thread. As I've dug deeper and deeper into this benching and overclocking madness, I have become more and more interested in Ram. Specifically what Ic's tend to OC or be able to tighten timings better then others. Thanks.
