holist2002
New Member
- Joined
- Apr 11, 2015
I'm looking at some passive chipset heatsinks, (for inside a fan cooled case (fans blowing in)). Like 13x13x6mm aluminum grid-cut heatsinks. How much will these help cooling? How much will they reduce cfm requirements, to maintain the same temps?
The adhesive tape can have a W/m*K of .6 to 1... whereas the permanent adhesive or epoxy from a 2 syringes can be as much as 7.5 W/m*K
How much of a difference is that in real life results?
((looking at a few - all aluminum, adhesive tape, all grid cut, some have the fins splayed. some around 13x13x6mm, and some around 20x20x10mm or larger))
The adhesive tape can have a W/m*K of .6 to 1... whereas the permanent adhesive or epoxy from a 2 syringes can be as much as 7.5 W/m*K
How much of a difference is that in real life results?
((looking at a few - all aluminum, adhesive tape, all grid cut, some have the fins splayed. some around 13x13x6mm, and some around 20x20x10mm or larger))