Has anyone gotten their hands on some indium solder that Intel used to use, and tried to solder a water block directly to the die after de-lidding? This seems like it would be the most effective method of heat removal (i.e. water in a water cooled loop), as someone pointed out less steps to get the heat from the die to the source carrying it off would tend to work more efficiently (or so I would think). All you would need to do is to take block apart (so as to not destroy O-rings or plastics on block) heat and apply pressure. I'm sure with some calculations you could figure out how much solder to use to get the achieved coverage at the desired thickness so as to not push solder over the edge and make contact with the rest of the cpu, then it would just be how much pressure to apply to get an even spread. Sound simple, surely someone here has done this and wants to share the results?
Edit:
On post 57 above, what are those cracks, are they just were the old solder is still bonded to the die?
Edit:
On post 57 above, what are those cracks, are they just were the old solder is still bonded to the die?