- Joined
- Aug 14, 2014
Interesting read if it holds true ?
https://www.pugetsystems.com/labs/articles/Thermal-Paste-Application-Techniques-170/
https://www.pugetsystems.com/labs/articles/Thermal-Paste-Application-Techniques-170/
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I read the article and I don't see how you can get bubbles unless the paste is globbed on. I use a credit card and spread a rice sized portion over the entire card and end up probably wiping half off leaving me with a smooth & very thin coating. I've never seen an air bubble.
Is it really time consuming for people to spread paste? What's it take 30 seconds? 60?
You can use fingers too!
Finger in plastic bag.I wouldn't... This introduces oils from your skin.
Finger in plastic bag.
I know what he said.Which isn't what he said
I'll just stick to not spreading paste and letting the heatsink do it... lol!
I know what he said.
I was just mentioning the plastic bag because this is the old school method.
Sometimes you have to spread by hand. If you do not get 100% coverage on the older CPU's that take 2-4v vcore, they will cook as soon as you turn the power on. Bare die CPU's should be covered 100% also. 1 hot spot will kill it in a second.
I wouldn't... This introduces oils from your skin.
Oh, I agree, legacy hardware is 100% different from our modern hardware. Especially anything bare die, but it's also easier to cover a die than an IHS.
The legacy hardware is no different than current. You use the spread method when renewing thermal compound under Intel IHS. I do the same spread method with de-lidded AMD chips and block to die applications. (and have done quite a few Intels too)