- Joined
- Mar 5, 2002
- Location
- Bellevue, WA
Well, I have been doing a bit of thinking, mainly along the lines of bonding a chip directly as a part of the expansion chamber. Now I realize that this would be a bit difficult as it would have to withstand high high pressures, but is this possible and has it been done?
I am fully reticent of the fact that I am exposing a seal to ambient temps on one side and temperatures well into the -40s on the other side.
Still, there should be something that would work for this. I am sure there is something rated for high PSIs.
Otherwise, I am going to have to get back to my main project and that means I have to mill a block and I am trying to find something to distract me from that slight unpleasantness for a while. Like DD phase change.
Futura
I am fully reticent of the fact that I am exposing a seal to ambient temps on one side and temperatures well into the -40s on the other side.
Still, there should be something that would work for this. I am sure there is something rated for high PSIs.
Otherwise, I am going to have to get back to my main project and that means I have to mill a block and I am trying to find something to distract me from that slight unpleasantness for a while. Like DD phase change.
Futura