Every manufacturing process has variables both in the materials used and in the process itself. For cpus - there will be very little difference in variation for cpus's on the same wafer (the variation in this instance will be on its position within the stepped image not on its location on the wafer) there will then be a greater variation on cpus from the same batch but different wafers and the greatest variation will be on a batch to batch basis this is where the date code on the stepping becomes most important