Misleading yes, outright lying, I'm not sure about that.
It's like saying:
"Thermally conductive skived device is carefully treated with a high intensity silicate oscillator that features over two thousand particles per square inch. This precision proccess over a silvered silicon based, optically clear surface ensures even contact with the processor core and maximizes overclocking potential. The CPU is then impregnated with atomized silver particles suspended in a ceramic/silicon substrate that further reduces thermal load across the core. Our extensive, painstaking proccess guarantees your CPU will overclock to its rated maximal speed."
What I just described is lapping a damn heatsink on a mirror with some 2000 grit sandpaper and slapping some arctic silver on a cpu. Most manufacturers bend a truth a little bit. OCZ is claiming that sandblasting a few millimeters of packaging off the ICs is some high-tech, scientific way of maximizing performance. While I have no doubt that the sand blasting does what it's supposed to do, I have to admit, the OCZ site's description of the proccess comes really close to the limit on bending the truth and lying.