1st post, hi all
I just started building a computers again since a few years ago and I've noticed alot of the ram I buy with heat spreaders on them now have the spreaders attached with foam tape whereas I recall them having more direct contact with the chips themselves. This seems really counterproductive to me and was wondering if someone could shed some light.
It's not a big issue because I normally build for friends/neighbors/family that won't be OCing and I keep adequate airflow in the cases.
I just started building a computers again since a few years ago and I've noticed alot of the ram I buy with heat spreaders on them now have the spreaders attached with foam tape whereas I recall them having more direct contact with the chips themselves. This seems really counterproductive to me and was wondering if someone could shed some light.
It's not a big issue because I normally build for friends/neighbors/family that won't be OCing and I keep adequate airflow in the cases.