G.SKILL To Attend IDF 2013, Showing Next Generation Memory

G.Skill passed along a bit of news this morning in the form of a press release, so we thought we’d share it with our readers. Always looking to push memory performance to the next level, G.Skill’s first visit to the Intel Developer Forum will showcase their high performance Quad Channel DDR3 memory and give us some insight into their future plans for upcoming DDR4 memory.

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Taipei, Taiwan – 29th August, 2013 – G.SKILL International Co. Ltd., the leading high-performance memory designer and manufacturer, announced to participate this year’s Intel Developer Forum at San Francisco as part of Intel’s memory community at booth no. 165, displaying maximum DDR3 memory frequency & capacity on the new Intel® Core™ i7 processor family for socket LGA-2011 platform, also sharing plans for future technology such as DDR4.

“As this is our first time attending IDF, we are very excited to show our high performance quad channel DDR3 memory and also announce our plans for DDR4,” said Mark Yu – Technical Marketing at G.SKILL.

If you’ll be attending IDF 2013 San Francisco, be sure to stop by booth 165 and check out G.Skill’s product offerings, they are known to put on a good show!

-Dino DeCesari (Lvcoyote)

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