Press Release - G.Skill Launches Ares Low Profile Memory

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G.Skill’s RipjawsX / RipjawsZ kits were already pretty low profile, but these are even more diminutive. We don’t usually regurgitate press releases, but there are so many people with large CPU coolers that want stronger memory it seemed this one was pretty relevant. Now you can have your high-performance cake and eat it too!


G.Skill Launches Its New Ares! Low Profile Extreme Performance DDR3 Memory Kits

– Trouble free with super large CPU coolers –

Taipei-Taiwan – February 8th 2012. G.Skill, the worldwide leading high performance memory designer and manufacturer, has announced the brand new Ares series low profile performance DDR3 memory.

G.Skill Ares Memory

G.Skill Ares Memory - Blue

G.Skill Ares - Orange

G.Skill Ares - Orange

Stylish Low Profile Heat Spreader

Featured with low profile heat spreader design (3.2cm in height), G.Skill Ares series DDR3 memory modules are the perfect choices for building high performance PCs with large CPU coolers, small form factor desktop computers or any other systems with more restricted space.

The Best Compatibility and Reliability 

Every Ares memory kit is hand-tested with G.Skill rigorous internal validation process to ensure the maximum stability and compatibility with both Intel and AMD platforms.

XMP Ready

Compliant with the latest Intel XMP (Extreme Memory Profile) function, G.Skill Ares series DDR3 memory provides PC enthusiasts and extreme gamers a trouble free overclocking experience on Intel platforms, while enjoying the enhanced memory bandwidth.

G.Skill Ares specifications are listed as below. Specifications are subject to change without notice. For further details please check the G.Skill website at www.gskill.com

Frequency Timing Available Capacity Voltage Color Model
1333MHz CL 9-9-9-24 8GB(4Gx2)/16GB(4GBx4)(8GBx2)/32GB(8GBx4) 1.5V Orange AO
1600MHz CL10-10-10-30 16GB(8GBx2)/32GB(8GBx4) 1.5V Orange AO
1600MHz CL 9-9-9-24 8GB(4GBx2)/16GB(4GBx4) 1.5V Orange/Blue AO/AB
1600MHz CL 8-8-8-24 8GB(4GBx2)/16GB(4GBx4) 1.5V Blue AB
1866MHz CL 9-10-9-28 8GB(4GBx2)/16GB(4GBx4) 1.5V Blue AB
1866MHz CL10-11-10-30 16GB(8GBx2)/32GB(8GBx4) 1.5V Blue AB
2133MHz CL11-11-11-31 8GB(4GBx2)/16GB(4GBx4) 1.6V Orange AO
2133MHz CL9-11-10-28 8GB(4GBx2)/16GB(4GBx4) 1.65V Blue AB

All G.Skill memory products come with a lifetime warranty and the G.Skill technical team is always ready to provide consumers with complete technical support via online forums, telephone and email.


No word on pricing yet.

– Jeremy Vaughan (hokiealumnus)

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Discussion
  1. Tight timings drive up prices due to the added cost of making them to such tight tolerances. With most CPUs now pushing huge caches in front of the RAM. it's not that important as it use to be. The main issue with these larger chip arrays is the number of control lines needed to access they increases drag on the drivers. Now if the same resonant grid tech used in the clock circuits being developed can make it way over to DRAM then we might see a 20-30% drop in lats. What the grid does is stabilize signals across multiple parallel control paths allowing the signals to hit all affected chips nanoseconds closer to absolute tight timings. Search "resonant grid" for more details.
    Higher kits ( 2133+ ) are on Hynix IC like almost everything else now. Lower I'm not sure but can be samsung. I can't find any reviews with IC info for 1600-1866 sets.

    For me PCB looks more like that from RipjawsX on Hynix IC that I had some months ago ... seems like it's time for someone to buy them and check :D ( not me , just ordered one of last elpidas :p )
    yea i can, just having a hard time figuring out which ram sinks to go with atm. would be nice though if someone here had a review kit and could take the sinks off to ID the IC's. i think im half right on them being samsung IC's, as the pcb is black on my two kits. with out closer pics of the edges of the pcb's it would be hard to say without takin the sinks off.

    *edit*

    after looking over the pics agian of the gskill ram, but closer up this time on my tv. the ram does in fact look to be normal height ram as if you look as the samsung review. there are less tabs on the sides of the pcb's, however that does not stop gskill from having custom pcb's made for samsung ic's. not only that but between the notches on the pin side my sammys say "green ddr3" as the ones shown dont. i need to get a digi cam agian. :x
    makes me wonder if they are using samsung IC's now... as someone posted a while back of a LP kit samsung has out. looking at the 8gig kit, it does look like it could be. as gskill is speccing at 1.5v which the samsung kit can handle, if that is the case they tighen up but not as much as would be needed for a .15v increase. could just be gskill is playing it safe on the timings/voltage for the ram kits. i picked up two samsung 8gig kits at fry's local for $39.99 each even with taxes that is cheaper then newegg. im thinking of some ram sinks since i plan on pushing them with 1.65v and see what they do speed/timing wise.

    btw here is the frontpage article about the samsung LP 8gig kit.

    http://www.overclockers.com/forums/showthread.php?t=694004
    i dont think we will ever get performance kits without heat spreaders any more, because of how much the ram is an understated part of the system you might aswell have it look nice, it looks great when it matches the mobo heatsinks to :)
    ^^^

    When I built my uncle's protools box, I got the cheapest 1333mhz G-Skill kit I could find because he wanted 16GB. No heatspreaders, no stability problems. They're honestly mostly unnecessary nowadays.

    kskwerl
    XFD @ "1600MHz CL10-10-10-30"

    ....wut??


    I remember a time when I used to care about RAM timings. With my current build I did some tests with faster timings and didn't see any change at the same clocks other than a slight bump in a synthetic benchmark, so I just didn't bother other than setting them to 1T CR. I don't know if this means I'm getting old, or if Intel's memory controllers are just that good now that timings really don't matter beyond 1600mhz/CAS9. At least it makes RAM shopping cheaper than ever.

    Even the heatspreaders on my RipjawsX are ridiculous, given that they don't even hit 40C at 1.52V.
    Diggrr
    The heatspreaders sure are purty. Too bad no one makes a case large enough to stick your head in and see them after installing.

    Nice and thick too, limits cooling between sticks.

    Genius!

    I wish they'd just glue on some 1mm copper and laser etch size and other info on that. Let the ram really breathe cool.

    I know it probably isn't easy "snazzing" up the ram for retail packaging, but why make it look like the hood of a Lotus?

    **BTW, I DO appreciate the low profile, and loss of the "Sonic" hairdo.


    Can't we just have RAM without heatspreaders? RAM isn't even very hot anymore.
    The heatspreaders sure are purty. Too bad no one makes a case large enough to stick your head in and see them after installing.

    Nice and thick too, limits cooling between sticks.

    Genius!

    I wish they'd just glue on some 1mm copper and laser etch size and other info on that. Let the ram really breathe cool.

    I know it probably isn't easy "snazzing" up the ram for retail packaging, but why make it look like the hood of a Lotus?

    **BTW, I DO appreciate the low profile, and loss of the "Sonic" hairdo.
    kskwerl
    XFD @ "1600MHz CL10-10-10-30"

    ....wut??


    No kidding. It's like the companies are just getting lazy and not even trying to find new ram tech these days. We have been sitting at the current ~9,9,9 for a while now with an occasional 7,8,7 that is unreliable. Sad days indeed.
    Black PCB looks like that from RipjawsX 4GB sticks 1600-1866 that I saw on Hynix IC. Hard to say what is inside but I can't see there anything special. If they had to use 1.65V for best clocking set then I wouldn't count on anything much above average. ( Latest Samsung IC can prove that I can be wrong but Samsung is on lower voltage ). I'm just waiting for some good review.
    BugFreak
    It's funny to see a "new" release of the same old heatspreaders that have been around for years. G-Skill is the only one doing it too. So far the only true low profile I have seen were those Samsung posted here not too long ago. Those things were tiny!

    EDIT: Just realized you basically said that johan but still true.


    I reviewed those sticks and they didn't even stick above the holding clips.
    It's funny to see a "new" release of the same old heatspreaders that have been around for years. G-Skill is the only one doing it too. So far the only true low profile I have seen were those Samsung posted here not too long ago. Those things were tiny!

    EDIT: Just realized you basically said that johan but still true.
    Dual & Quad. Tri-chan is (as of X79) apparently in the past. They still have existing tri-chan kits but doesn't look like they're looking back with this release. :)