AMD’s 3rd Gen EPYC Processors due to Launch March 15th

March 9, 2021 John Nester News, Processors 2

AMD has scheduled the digital launch of its 3rd Generation EPYC processors for March 15th, 2021. EPYC is AMD’s Server and Datacenter grade processor and is utilized for cloud management, database analytics, virtualization, and many other services. The 3rd Gen EPYC, code-named Milan, will be based on the Zen 3 architecture and feature up to 64 cores, 7nm process node, and 280W TDP.

AMD 3rd Gen EPYC Processor Digital Launch March 15th

AMD (NASDAQ: AMD) will host a digital global launch of the new 3rd Gen AMD EPYC™ processors on Monday, March 15, 2021 at 8 a.m. PT / 11 a.m. ET.
The digital launch is slated to feature presentations by AMD President and CEO Dr. Lisa Su, Executive Vice President of Technology and Engineering and CTO Mark Papermaster, Senior Vice President and General Manager, Datacenter and Embedded Solutions Business Group, Forrest Norrod, Senior Vice President and General Manager, Server Business Unit, Dan McNamara and appearances by industry-leading data center partners and customers.

The launch will be accessible on the 3rd Gen AMD EPYC launch site starting at 8 a.m. PT/11 a.m. ET. A replay of the webcast can be accessed after the conclusion of the live stream event and will be available for one year after the event.

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About AMD

For more than 50 years AMD has driven innovation in high-performance computing, graphics and visualization technologies ― the building blocks for gaming, immersive platforms and the data center. Hundreds of millions of consumers, leading Fortune 500 businesses and cutting-edge scientific research facilities around the world rely on AMD technology daily to improve how they live, work and play. AMD employees around the world are focused on building great products that push the boundaries of what is possible. For more information about how AMD is enabling today and inspiring tomorrow, visit the AMD (NASDAQ: AMD) website, blog, Facebook and Twitter pages.

 

-John Nester (Blaylock)

 

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John started writing and reviewing PC components for Overclockers.com in 2015, but his passion for PCs dates all the way back to the early 1980s. His first personal computer was a Commodore 64 with a cassette drive. As a dedicated member of the news team, he focuses his articles on new product releases and software updates. He reviews a wide variety of PC components including chassis, storage drives, keyboards, and more. John works in technology as a C.A.D. designer for a major automotive manufacturer. His other passions in life include motorcycles, hunting, guns, and football.

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Noctua has just announced its NA-TPG1 thermal paste guard for AMD’s new Ryzen 7000 series CPUs. Most of you know by now that there is quite a bit of concern over AMD’s new heat spreader design for the Ryzen 4 CPUs. The “cut-out” will undoubtedly become thermal paste troughs and make the cleaning of old paste from CPUs far more difficult. Noctua’s solution, the NA-TPG1, is a thin polycarbonate guard that helps to reduce the mess. Availability is expected in December and will be sold individually ($7.90), or bundled with the NT-H1 ($9.90) and NT-H2 ($13.90) AM5 Edition Thermal pastes. Below is Noctua’s press release.

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Joseph@123

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5 messages 1 likes
#1 Jan 17, 2022

Thank you for being such a great knowledge in this field

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Blaylock

"That Backfired" Senior Member

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#2 Jan 17, 2022

:welcome: to the Forums @Joseph@123 and thank you for the kind words. We're all here learning, myself included.

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