Hello Everyone,
I was testing a new computer at work that was running warmer than I usually see (the problem PC ran at about about 68C while running OCCT; normally other computers of the same model run between 55C-60C ), and when I removed the heat sink I found that instead of regular heat sink compound, there was a foil pad attached to the heat sink, and just some residue on the processor itself (see picture). Has anyone seen this used before, or did someone at the factory make a mistake? I saw a few posts about foil pads with heat sink compound on them, but not just the pad alone.
Thanks for any help.
I was testing a new computer at work that was running warmer than I usually see (the problem PC ran at about about 68C while running OCCT; normally other computers of the same model run between 55C-60C ), and when I removed the heat sink I found that instead of regular heat sink compound, there was a foil pad attached to the heat sink, and just some residue on the processor itself (see picture). Has anyone seen this used before, or did someone at the factory make a mistake? I saw a few posts about foil pads with heat sink compound on them, but not just the pad alone.
Thanks for any help.