CoopertownBob (Mar 29, 2001 04:31 p.m.):
Lap and reseat the HS. The proc is running way to hot for such a low board temp. Use plenty of grease, the HS will flatten it out thin enough.
Turn that fa non the back around to blow into the case. You want over pressure, not under. How is the clutter in the case? IDE cables rolled?
What kind of HSF do you have anyway?
I'd leave the fans the way they are. You actually want more exhaust fans (out) than intake fans.
You can pump air into the case, but if you can't get it out as fast or faster, that air is just going to heat up and raise the air temp inside the case.
An anology I've used here before is comparing the PC to a car...let's call it a Camaro, 'cuz I'm a Chevy boy, and they usually get overclocked a lot....
Take your stock Chevy engine, and replace the low rise aluminum intake/Rochester QuadraJet 4 barrel carburetor with a high rise Edelbrock tunnel ram, with dual quad 850 CFM Holley doublepumpers. Gonna go like a bat out of hell now, right?
Nope... not until you replace the cheezy 2 1/2 inch exaust that GM put on the car. Backpressure is the key here. While you've dramatically increased the air/fuel intake, the exaust isn't getting the spent gases out of the engine fast enough. Case cooling works on a similar principle.
If you have a case fan on the front and back, BOTH blowing IN, that's just going to create a lot of turbulence, and disrupt a smooth air flow inside the box. You want to keep the air moving in one direction, with as few obstructions as possible. This is why the "rounded" ribbon cables sell so well.
If your local library subscribes to this, "MaximumPC" magazine had an excellent article on case cooling tips and techniques in their Nov. 2000 issue. Try to find a copy, as it sheds a lot of light on what works and what doesn't.
Mr B