2700x freeze, help!

[eurgbp]

Hi
asrock a320m hdv r3

Cannot solve this problem
when there is no load pc works fine
but in 3dmark bench tests freezes after 10 to 30 seconds

nothing is overclocked
bought it new from ebay germany

updated bios
updated amd chipset
latest rtx drivers

etc

is this cpu defective?

Please help

logs are here View attachment log.zip

here is temp logs hwinfo64 https://drive.google.com/open?id=1tjioVMMy76EsaT7_dhARexZYLTbQr4Wd
specs https://drive.google.com/open?id=1XZUTJcdlc3zmiqG3xRCXY-vVuVVcdTL5

temp logs and stats are here https://drive.google.com/drive/folders/1r2xUtCTWQ0AyW0-qwPSO-0JYSrGMSHGW?usp=sharing



AMD Ryzen 7 2700X

[General Information]
Processor Name: AMD Ryzen 7 2700X
Original Processor Frequency: 3700.0 MHz
Original Processor Frequency [MHz]: 3700

CPU ID: 00800F82
Extended CPU ID: 00800F82
CPU Brand Name: AMD Ryzen 7 2700X Eight-Core Processor
CPU Vendor: AuthenticAMD
CPU Stepping: <AMD Zen/Pinnacle Ridge>
CPU Code Name: Pinnacle Ridge
CPU Technology: 12 nm
CPU Thermal Design Power (TDP): 105.0 W
CPU Max. Junction Temperature (Tj,max): 85 °C
CPU Platform: AM4
Microcode Update Revision: 800820B
SMU Firmware Revision: 43.20.0

Number of CPU Cores: 8
Number of Logical CPUs: 16

[Operating Points]
CPU HFM (Base): 3700.0 MHz = 37.00 x 100.0 MHz
CPU Boost Max: [Unlimited]
CPU Current: 4091.2 MHz = 41.00 x 99.8 MHz @ 1.3438 V

CPU Bus Type: UMI

[Cache and TLB]
L1 Cache: Instruction: 8 x 64 KBytes, Data: 8 x 32 KBytes
L2 Cache: Integrated: 8 x 512 KBytes
L3 Cache: 2 x 8 MBytes
Instruction TLB: Fully associative, 64 entries
Data TLB: Fully associative, 64 entries

[Standard Feature Flags]

 

[Johan45]

First, that board looks a bit anemic to be running the 8-core CPU but it is on the support list.
What do you have for cooling?
What is your RAM and how is it set?

 

[eurgbp]

Memory Device

Total Width: 64 bits
Data Width: 64 bits
Device Size: 8192 MBytes
Device Form Factor: DIMM
Device Locator: DIMM 0
Bank Locator: P0 CHANNEL A
Device Type: DDR4
Device Type Detail: Synchronous
Memory Speed: 2400 MHz
Manufacturer: Unknown
Serial Number: 01040408
Part Number: TEAMGROUP-UD4-2400
Asset Tag: Unknown

Stock cooler

CPU temp is ok


700 Watt PSU


these are temps before crash in 3dmark

https://drive.google.com/open?id=1tjioVMMy76EsaT7_dhARexZYLTbQr4Wd



CPU temp 42 C


CPU+SoC Power (SVI2 TFN) 28.188 W
[ASRock A320M-HDV R3.0 (Nuvoton NCT6793D)]
Motherboard 36.0 °C
CPU 36.5 °C
Auxiliary 36.0 °C
AUXTIN1 110.0 °C
AUXTIN2 110.0 °C
AUXTIN3 110.0 °C
CPU (PECI) 40.0 °C
Vcore 0.680 V
VIN1 1.904 V
AVCC 3.440 V
3VCC 3.392 V
VIN0 0.248 V
VIN4 0.808 V
3VSB 3.424 V
VTT 1.784 V
VIN5 0.176 V
VIN6 0.128 V
VIN2 1.904 V
VIN3 1.720 V
VIN7 0.184 V
CPUFANIN0 2119 RPM
Chassis Intrusion No
[S.M.A.R.T.: Verbatim Vi500 S3 480GB SSD (I47195R000439)]
Drive Temperature 41 °C
Drive Failure No
Drive Warning No

23.2.2019 12:34:46.385 8895 9851 47.4 5505 10809 33.7 0 1.269 1.3 1.331 1.319 1.337 1.325 1.294 1.319 4066.2 4066.2 4066.2 4091.2 4091.2 4066.2 4066.2 4066.2 99.8 53.8 11.5 69.2 23 38.4 3.8 26.9 11.5 23 19.2 19.2 11.5 26.9 7.6 15.3 7.6 69.2 23 40.8 40.8 40.8 41 41 40.8 40.8 40.8 1197.4 12 16 16 16 39 55 421 2 110.3 100.3 1.287 0.825 56.659 5.588 62.461 4.827 6.364 3.506 3.329 3.602 2.436 3.487 2.497 72.948 4.61 77.559 40 42 40 109 108 107 40 0.664 1.832 3.424 3.36 0.248 0.744 3.408 1.776 0.176 0.128 1.824 1.72 0.192 2202 No 43 No No 0 0 0 0 0 13753 580 12 156 21.267 1122.962 0
23.2.2019 12:34:46.782 8895 9852 47.4 5504 10810 33.7 0 1.313 1.313 1.319 1.337 1.313 1.325 1.325 1.319 4066.2 4066.2 4066.2 4091.2 4066.2 4066.2 4091.2 4066.2 99.8 26.9 24 36 26.9 48 12 24 11.5 26.9 26.9 42.3 7.6 42.3 7.6 30.7 8 48 25.1 40.8 40.8 40.8 41 40.8 40.8 41 40.8 1197.4 12 16 16 16 39 55 421 2 110 100 1.306 0.819 54.682 5.294 66.587 3.996 4.354 4.163 3.258 3.96 3.876 4.05 2.974 71.429 4.335 75.763 40 42 40 108 108 107 40 0.664 1.824 3.424 3.344 0.248 0.744 3.424 1.776 0.176 0.128 1.816 1.72 0.192 2202 No 43 No No 0 0 0 0 0 13753 580 12 156 41.232 966.917 0
23.2.2019 12:34:47.180 8896 9850 47.4 5504 10810 33.7 0 1.3 1.325 1.319 1.306 1.319 1.306 1.3 1.263 4066.2 4066.2 4066.2 4066.2 4066.2 4066.2 4066.2 4066.2 99.8 20 7.6 42.3 8 26.9 7.6 7.6 12 16 20 16 0 44 4 4 30.7 44 16.7 40.8 40.8 40.8 40.8 40.8 40.8 40.8 40.8 1197.4 12 16 16 16 39 55 421 2 109.9 99.9 1.306 0.819 52.047 5 62.939 3.303 4.362 3.74 2.834 4.076 2.773 4.483 4.081 67.986 4.094 72.08 40 42 40 108 108 107 40 0.656 1.84 3.424 3.344 0.248 0.744 3.424 1.776 0.176 0.128 1.84 1.72 0.192 2202 No 43 No No 3.7 0.9 4.7 6.522 3.104 13756 581 12 156 28.961 1071.382 0
23.2.2019 12:34:47.580 8894 9852 47.4 5502 10812 33.7 0 1.3 1.325 1.319 1.325 1.313 1.331 1.325 1.313 4041.3 4066.2 4066.2 4066.2 4066.2 4066.2 4066.2 4066.2 99.8 11.5 20 26.9 28 20 32 30.7 15.3 38.4 30.7 15.3 11.5 26.9 11.5 15.3 50 50 24 40.5 40.8 40.8 40.8 40.8 40.8 40.8 40.8 1197.4 12 16 16 16 39 55 421 2 109.9 99.9 1.306 0.825 44.141 5.588 67.234 3.938 4.051 3.984 2.88 4.192 2.65 4.559 4.981 57.659 4.61 62.27 40 42 40 108 108 107 40 0.656 1.84 3.424 3.344 0.248 0.744 3.424 1.776 0.176 0.128 1.84 1.72 0.192 2235 No 43 No No 1 2.3 3.2 0.759 6.681 13756 583 12 157 28.786 1090.348 0
23.2.2019 12:34:47.981 8894 9852 47.4 5502 10812 33.7 0 1.331 1.306 1.325 1.269 1.306 1.319 1.313 1.331 4066.2 4066.2 4066.2 4066.2 4066.2 4066.2 4066.2 4066.2 99.8 28 11.5 40 23 30.7 19.2 28 20 24 44 28 12 24 8 16 32 44 24.3 40.8 40.8 40.8 40.8 40.8 40.8 40.8 40.8 1197.4 12 16 16 16 39 55 421 2 109.9 99.9 1.287 0.819 60.612 5.882 61.432 3.094 3.813 3.735 3.67 3.981 2.717 4.344 2.599 78.038 4.816 82.854 40 42 40 108 108 107 40 0.664 1.832 3.424 3.344 0.248 0.744 3.424 1.776 0.176 0.128 1.848 1.72 0.192 2235 No 43 No No 0 0.1 0.1 0 0.112 13756 583 12 157 18.878 955.952 0
23.2.2019 12:34:48.379 8895 9851 47.4 5502 10812 33.7 0 1.319 1.325 1.306 1.294 1.3 1.313 1.325 1.337 4066.2 4091.2 4066.2 4041.3 4066.2 4066.2 4066.2 4066.2 99.8 30.7 3.8 65.3 0 26.9 19.2 3.8 15.3 15.3 53.8 11.5 15.3 23 7.6 15.3 11.5 65.3 19.9 40.8 41 40.8 40.5 40.8 40.8 40.8 40.8 1197.4 12 16 16 16 39 55 421 2 109.9 99.9 1.331 0.819 32.941 5 62.77 2.66 4.931 4.233 2.632 3.729 3.317 4.17 2.926 43.853 4.094 47.947 40 42 40 108 108 107 40 0.656 1.864 3.424 3.36 0.248 0.744 3.424 1.776 0.176 0.128 1.848 1.72 0.192 2213 No 43 No No 0 0 0 0 0 13756 583 12 157 18.235 753.485 0

- - - Auto-Merged Double Post - - -

Row: 0 - 8 GB PC4-19200 DDR4 SDRAM Team Group TEAMGROUP-UD4-2400

[General Module Information]
Module Number: 0
Module Size: 8 GBytes
Memory Type: DDR4 SDRAM
Module Type: Unbuffered DIMM (UDIMM)
Memory Speed: 1200.5 MHz (DDR4-2400 / PC4-19200)
Module Manufacturer: Team Group
Module Part Number: TEAMGROUP-UD4-2400
Module Revision: 0.0
Module Serial Number: 134480897
Module Manufacturing Date: Year: 2018, Week: 51
Module Manufacturing Location: 0
SDRAM Manufacturer: SpecTek
Error Check/Correction: None

[Module Characteristics]
Row Address Bits: 16
Column Address Bits: 10
Module Density: 8192 Mb
Number Of Ranks: 1
Device Width: 8 bits
Bus Width: 64 bits
Die Count: 1
Module Nominal Voltage (VDD): 1.2 V
Minimum SDRAM Cycle Time (tCKAVGmin): 0.83300 ns
Maximum SDRAM Cycle Time (tCKAVGmax): 1.50000 ns
CAS# Latencies Supported: 11, 12, 13, 14, 15, 16, 18
Minimum CAS# Latency Time (tAAmin): 13.320 ns
Minimum RAS# to CAS# Delay (tRCDmin): 13.320 ns
Minimum Row Precharge Time (tRPmin): 13.320 ns
Minimum Active to Precharge Time (tRASmin): 32.000 ns

Supported Module Timing at 1200.0 MHz: 16-16-16-39
Supported Module Timing at 1066.1 MHz: 15-15-15-35
Supported Module Timing at 1000.0 MHz: 14-14-14-32
Supported Module Timing at 933.3 MHz: 13-13-13-30
Supported Module Timing at 866.7 MHz: 12-12-12-28
Supported Module Timing at 800.0 MHz: 11-11-11-26

Minimum Active to Active/Refresh Time (tRCmin): 45.375 ns
Minimum Refresh Recovery Time Delay (tRFC1min): 350.000 ns
Minimum Refresh Recovery Time Delay (tRFC2min): 260.000 ns
Minimum Refresh Recovery Time Delay (tRFC4min): 160.000 ns
Minimum Four Activate Window Delay Time (tFAWmin): 21.000 ns
Minimum Active to Active Delay Time - Different Bank Group (tRRD_Smin): 3.299 ns
Minimum Active to Active Delay Time - Same Bank Group (tRRD_Lmin): 4.900 ns
Minimum CAS to CAS Delay Time - Same Bank Group (tCCD_Lmin): 5.000 ns

[Features]
Module Temperature Sensor (TSOD): Not Supported
Module Nominal Height: 31 - 32 mm
Module Maximum Thickness (Front): 1 - 2 mm
Module Maximum Thickness (Back): <= 1 mm
Address Mapping from Edge Connector to DRAM: Standard


Row: 1 - 8 GB PC4-19200 DDR4 SDRAM Team Group TEAMGROUP-UD4-2400

[General Module Information]
Module Number: 1
Module Size: 8 GBytes
Memory Type: DDR4 SDRAM
Module Type: Unbuffered DIMM (UDIMM)
Memory Speed: 1200.5 MHz (DDR4-2400 / PC4-19200)
Module Manufacturer: Team Group
Module Part Number: TEAMGROUP-UD4-2400
Module Revision: 0.0
Module Serial Number: 2164458497
Module Manufacturing Date: Year: 2018, Week: 51
Module Manufacturing Location: 0
SDRAM Manufacturer: SpecTek
Error Check/Correction: None

[Module Characteristics]
Row Address Bits: 16
Column Address Bits: 10
Module Density: 8192 Mb
Number Of Ranks: 1
Device Width: 8 bits
Bus Width: 64 bits
Die Count: 1
Module Nominal Voltage (VDD): 1.2 V
Minimum SDRAM Cycle Time (tCKAVGmin): 0.83300 ns
Maximum SDRAM Cycle Time (tCKAVGmax): 1.50000 ns
CAS# Latencies Supported: 11, 12, 13, 14, 15, 16, 18
Minimum CAS# Latency Time (tAAmin): 13.320 ns
Minimum RAS# to CAS# Delay (tRCDmin): 13.320 ns
Minimum Row Precharge Time (tRPmin): 13.320 ns
Minimum Active to Precharge Time (tRASmin): 32.000 ns

Supported Module Timing at 1200.0 MHz: 16-16-16-39
Supported Module Timing at 1066.1 MHz: 15-15-15-35
Supported Module Timing at 1000.0 MHz: 14-14-14-32
Supported Module Timing at 933.3 MHz: 13-13-13-30
Supported Module Timing at 866.7 MHz: 12-12-12-28
Supported Module Timing at 800.0 MHz: 11-11-11-26

Minimum Active to Active/Refresh Time (tRCmin): 45.375 ns
Minimum Refresh Recovery Time Delay (tRFC1min): 350.000 ns
Minimum Refresh Recovery Time Delay (tRFC2min): 260.000 ns
Minimum Refresh Recovery Time Delay (tRFC4min): 160.000 ns
Minimum Four Activate Window Delay Time (tFAWmin): 21.000 ns
Minimum Active to Active Delay Time - Different Bank Group (tRRD_Smin): 3.299 ns
Minimum Active to Active Delay Time - Same Bank Group (tRRD_Lmin): 4.900 ns
Minimum CAS to CAS Delay Time - Same Bank Group (tCCD_Lmin): 5.000 ns

[Features]
Module Temperature Sensor (TSOD): Not Supported
Module Nominal Height: 31 - 32 mm
Module Maximum Thickness (Front): 1 - 2 mm
Module Maximum Thickness (Back): <= 1 mm
Address Mapping from Edge Connector to DRAM: Standard


Bus

- - - Auto-Merged Double Post - - -

Row: 0 - 8 GB PC4-19200 DDR4 SDRAM Team Group TEAMGROUP-UD4-2400

[General Module Information]
Module Number: 0
Module Size: 8 GBytes
Memory Type: DDR4 SDRAM
Module Type: Unbuffered DIMM (UDIMM)
Memory Speed: 1200.5 MHz (DDR4-2400 / PC4-19200)
Module Manufacturer: Team Group
Module Part Number: TEAMGROUP-UD4-2400
Module Revision: 0.0
Module Serial Number: 134480897
Module Manufacturing Date: Year: 2018, Week: 51
Module Manufacturing Location: 0
SDRAM Manufacturer: SpecTek
Error Check/Correction: None

[Module Characteristics]
Row Address Bits: 16
Column Address Bits: 10
Module Density: 8192 Mb
Number Of Ranks: 1
Device Width: 8 bits
Bus Width: 64 bits
Die Count: 1
Module Nominal Voltage (VDD): 1.2 V
Minimum SDRAM Cycle Time (tCKAVGmin): 0.83300 ns
Maximum SDRAM Cycle Time (tCKAVGmax): 1.50000 ns
CAS# Latencies Supported: 11, 12, 13, 14, 15, 16, 18
Minimum CAS# Latency Time (tAAmin): 13.320 ns
Minimum RAS# to CAS# Delay (tRCDmin): 13.320 ns
Minimum Row Precharge Time (tRPmin): 13.320 ns
Minimum Active to Precharge Time (tRASmin): 32.000 ns

Supported Module Timing at 1200.0 MHz: 16-16-16-39
Supported Module Timing at 1066.1 MHz: 15-15-15-35
Supported Module Timing at 1000.0 MHz: 14-14-14-32
Supported Module Timing at 933.3 MHz: 13-13-13-30
Supported Module Timing at 866.7 MHz: 12-12-12-28
Supported Module Timing at 800.0 MHz: 11-11-11-26

Minimum Active to Active/Refresh Time (tRCmin): 45.375 ns
Minimum Refresh Recovery Time Delay (tRFC1min): 350.000 ns
Minimum Refresh Recovery Time Delay (tRFC2min): 260.000 ns
Minimum Refresh Recovery Time Delay (tRFC4min): 160.000 ns
Minimum Four Activate Window Delay Time (tFAWmin): 21.000 ns
Minimum Active to Active Delay Time - Different Bank Group (tRRD_Smin): 3.299 ns
Minimum Active to Active Delay Time - Same Bank Group (tRRD_Lmin): 4.900 ns
Minimum CAS to CAS Delay Time - Same Bank Group (tCCD_Lmin): 5.000 ns

[Features]
Module Temperature Sensor (TSOD): Not Supported
Module Nominal Height: 31 - 32 mm
Module Maximum Thickness (Front): 1 - 2 mm
Module Maximum Thickness (Back): <= 1 mm
Address Mapping from Edge Connector to DRAM: Standard


Row: 1 - 8 GB PC4-19200 DDR4 SDRAM Team Group TEAMGROUP-UD4-2400

[General Module Information]
Module Number: 1
Module Size: 8 GBytes
Memory Type: DDR4 SDRAM
Module Type: Unbuffered DIMM (UDIMM)
Memory Speed: 1200.5 MHz (DDR4-2400 / PC4-19200)
Module Manufacturer: Team Group
Module Part Number: TEAMGROUP-UD4-2400
Module Revision: 0.0
Module Serial Number: 2164458497
Module Manufacturing Date: Year: 2018, Week: 51
Module Manufacturing Location: 0
SDRAM Manufacturer: SpecTek
Error Check/Correction: None

[Module Characteristics]
Row Address Bits: 16
Column Address Bits: 10
Module Density: 8192 Mb
Number Of Ranks: 1
Device Width: 8 bits
Bus Width: 64 bits
Die Count: 1
Module Nominal Voltage (VDD): 1.2 V
Minimum SDRAM Cycle Time (tCKAVGmin): 0.83300 ns
Maximum SDRAM Cycle Time (tCKAVGmax): 1.50000 ns
CAS# Latencies Supported: 11, 12, 13, 14, 15, 16, 18
Minimum CAS# Latency Time (tAAmin): 13.320 ns
Minimum RAS# to CAS# Delay (tRCDmin): 13.320 ns
Minimum Row Precharge Time (tRPmin): 13.320 ns
Minimum Active to Precharge Time (tRASmin): 32.000 ns

Supported Module Timing at 1200.0 MHz: 16-16-16-39
Supported Module Timing at 1066.1 MHz: 15-15-15-35
Supported Module Timing at 1000.0 MHz: 14-14-14-32
Supported Module Timing at 933.3 MHz: 13-13-13-30
Supported Module Timing at 866.7 MHz: 12-12-12-28
Supported Module Timing at 800.0 MHz: 11-11-11-26

Minimum Active to Active/Refresh Time (tRCmin): 45.375 ns
Minimum Refresh Recovery Time Delay (tRFC1min): 350.000 ns
Minimum Refresh Recovery Time Delay (tRFC2min): 260.000 ns
Minimum Refresh Recovery Time Delay (tRFC4min): 160.000 ns
Minimum Four Activate Window Delay Time (tFAWmin): 21.000 ns
Minimum Active to Active Delay Time - Different Bank Group (tRRD_Smin): 3.299 ns
Minimum Active to Active Delay Time - Same Bank Group (tRRD_Lmin): 4.900 ns
Minimum CAS to CAS Delay Time - Same Bank Group (tCCD_Lmin): 5.000 ns

[Features]
Module Temperature Sensor (TSOD): Not Supported
Module Nominal Height: 31 - 32 mm
Module Maximum Thickness (Front): 1 - 2 mm
Module Maximum Thickness (Back): <= 1 mm
Address Mapping from Edge Connector to DRAM: Standard


Bus

 

[trents]

Does the system crash when running stress tests that stress only the CPU?

Try IntelBurnTest on Very High setting and change the default "Times to Run" to 20. Or try Prime95. We need to separate whether the issue is related to CPU/memory instability or GPU instability.

Speaking of GPUs, what video card do you have installed?

What is the make and model of your PSU and how old is it?


Also, when we ask for information we don't want a list as long as your arm. Just basic parameters. For instance, RAM. All we need to know is brand, frequency, number of modules and total amount. You seem to by copying and pasting detailed info files out of Windows for every component and it makes sorting through all that to find the relevant information a difficult task. If you want guidance as to the information we really need, please refer to my Signature.

A tool that would be helpful to you and us is CPU-z. It gives a lot of info about your hardware and bios settings. The most important tabs are: "CPU," "Motherboard," "Memory," and "SPD". Installing that program and attaching pics of those tabs would be helpful.

 

[trents]

Also, make sure that in bios you have the memory frequency set to XMP.

 

[eurgbp]

what heatsinks and glue to buy for VRMs?

- - - Auto-Merged Double Post - - -

Does the system crash when running stress tests that stress only the CPU?

Try IntelBurnTest on Very High setting and change the default "Times to Run" to 20. Or try Prime95. We need to separate whether the issue is related to CPU/memory instability or GPU instability.

Speaking of GPUs, what video card do you have installed?

What is the make and model of your PSU and how old is it?


Also, when we ask for information we don't want a list as long as your arm. Just basic parameters. For instance, RAM. All we need to know is brand, frequency, number of modules and total amount. You seem to by copying and pasting detailed info files out of Windows for every component and it makes sorting through all that to find the relevant information a difficult task. If you want guidance as to the information we really need, please refer to my Signature.

A tool that would be helpful to you and us is CPU-z. It gives a lot of info about your hardware and bios settings. The most important tabs are: "CPU," "Motherboard," "Memory," and "SPD". Installing that program and attaching pics of those tabs would be helpful.

monitor nsync compatible 1440p 144hz DELL S2417DG
NVIDIA RTX 2080

system crashes almost immediately when I memtest or prime95
system crashes after 10 to 40 seconds in 3dmark benchmarks 1440p 144hz
system does not crash and complete benchmark ok in heaven and valley dx11 ultra tessalation 1440p 144hz
sysem is ok with furmark but tested for couple of minutes only, so it is okish

 

[eurgbp]

Heaven is fine
CPU benchmark is fine
memtest no so much

you cannot run any programs when memtesting right?
it wipes RAM clean correct?

- - - Auto-Merged Double Post - - -

could someone help me live at https://m.twitch.tv/julkalipka
?

 

[eurgbp]

Tried to set Soc to 1v and test was ok and applied and restart, but still ryzen master goes to default minimum 0.8v soc wtf?

- - - Auto-Merged Double Post - - -

MD product overclocking support provided by AMD OverDrive™ and the AMD Ryzen Master Application are mutually exclusive. The AMD OverDrive™ application remains the sole AMD-provided overclocking tool for the following AMD products:

Products in the AM3 and AM3+ socket infrastructure
Products in the FM2 and FM2+ socket infrastructure
Supported Operating Systems:
Windows 10 (64-bit)
Supported Chipset Models:
X370, B350, X399, B450, X470
Supported AMD products:
AMD Ryzen APU, AMD Ryzen CPU family in the AM4 socket and SP3r2 Socket infrastructure

 

[trents]

From your post over in t he AMD CPU section it looks like your problem with instability is heat-related. Since Heaven hardly uses the CPU it makes sense that system does not crash in that app but does in the others which utilize more of the CPU.

It would have been better if you had posted that temp info here in the original thread as now people have to look in two places to put that info together with the original problem as you describe it here. Maybe a moderator can join the two.

From the HWMonitor pics you attached in your other thread it looks like your CPU core voltage may be way too high. So when you run a CPU intensive app the CPU overheats. You should try setting the core voltage manually at a lower amount in bios. Try maybe 1.25 to start with. Have you looked at temps and voltages in Ryzenmaster, AMD's own monitoring software? I know that when Ryzen was new the third party monitoring apps were giving inaccurate readings.

 

[Johan45]

I'm not sure the OP is ale to set any variables since they're using a 320 chipset which doesn't give any OC options, that's likely the reason that Ryzen master resets itself as well.
I'm leaning more toward memory related instability, if memtest is crashing then that's your problem.
What memory kit do you have?

 

[trents]

I asked him for screen shots of CPU-z but none so far. That would give us good, concise info about his RAM and many other things.

I was also looking at his idle temps being in the 40's as posted in the CPU section. That's too high and often indicates vcore being too high or a poor cooler mount/poor TIM coverage.

 

[Johan45]

I asked him for screen shots of CPU-z but none so far. That would give us good, concise info about his RAM and many other things.

I was also looking at his idle temps being in the 40's as posted in the CPU section. That's too high and often indicates vcore being too high or a poor cooler mount/poor TIM coverage.

Agreed, just watched the vid from the other thread and 100C during CPUz test is way too high. You need to get your cooling undercontrol. The cooler included with the 2700X is a decent cooler and should be working better than that, or the board is heating up and just can't handle the load. Check the mount of the cooler and make sure as trents said that it's sitting properly. Just checked with my review and all core 4.0 small FFTs was still below 80C with the stock cooler.

 

[trents]

eurgbp, are you sure there is TIM (Thermal Interface Material, aka, thermal paste) between the cooler bottom and the CPU top? If this cooler was previously mounted you would need to make a new application of thermal paste.

 

[ShrimpBrime]

eurgbp, are you sure there is TIM (Thermal Interface Material, aka, thermal paste) between the cooler bottom and the CPU top? If this cooler was previously mounted you would need to make a new application of thermal paste.

Read here Trents if you haven't already https://www.overclockers.com/forums/showthread.php/793776-Idle-100-C-for-2700x?p=8107499#post8107499

Was suggested to merge, I'd agree Johan.

 

[trents]

Yeah, I read that already and just posted a reply to your last post over there. These threads need to be merged.