- Joined
- Sep 27, 2003
- Location
- Folding in Illinois
http://home.businesswire.com/portal...d=news_view&newsId=20040712005328&newsLang=en
Not entirely sure what its about, but it has something to do with using copper interconnects and 90nm technology and getting better yeilds. Theres a lot of mumbo-jumbo talk I don't understand, but it looks promising.
Not entirely sure what its about, but it has something to do with using copper interconnects and 90nm technology and getting better yeilds. Theres a lot of mumbo-jumbo talk I don't understand, but it looks promising.