I am going to install a 1GHz 266 CPU and a HSF unit (undetermined as of yet). My question is this: I've read several methods of applying thermal compound and most people seem to agree that you just apply a small amount to the base of the HSF unit and thinly spread it out over the surface... BUT, are we talking about the complete bottom surface of the HSF or just where the CPU die touches the HSF? From what I can see, there are four rubber stoppers at each corner of the CPU surface which helps keep the HSF level on the CPU, right? Does the thermal compound supposed to cover those too? In other words, do you apply the thermal compound only in the center or the entire surface of the HSF?? Or do you get creative and put it in the areas except where the rubber stoppers are ? Sorry if this is a stupid question, but I'm just trying to get it right and not fry it...