I still think that the standard white thermal paste is better, it is non conductive and fills the pits very easily. Also you cant really mess up by applying too much glue and covering the actual L1 bridges, or using tape to isolate the area. Clean the black of the pits with an eraser, smear some white goop, clean up white goop, lazer cuts are now white, apply defogger.
For anyone doing it the first time I suggest something easily cleanable. This is not hard to do, but I did mess it up pretty bad with the superglue method on my first try. I used a bit to much glue and it started to mound up a little higher then needed, I then used an exacto knife to clean it up, and scratched the chip and showed what looked like copper underneath the green wafer.
I took my time and tried not to be careless, but it would have been much easier if I could have just wiped it up.
Btw after I got it to work the second time around (on a new processor), It took me about 60 seconds to complete, the thermal goop/ defogger method takes me around 45sec total.
Just my opinion though.