SOLVED athlon 1.3 heat pleasssssssse help

[saint]

hi all
well im not an overclocker but wanted this forum help cause you guys are pros.
i just bought a new pc:amd 1.3,asus a7v-e mb etc
i have a coolermaster heatsink and fan,one case fan infront to intake air second in the back to put it out and the ps fan.
but still my temps are high,at idle i get 57 c temp
and when runnig games its up to 62c.
i hope i installed the heatsink well(i just pilled the sticcker from the bottom and put it over the cpu
the temperature is measured by the asus probe software which is like my bios temps
please how can i lower the temps help.
also if anyone knows about usb bugs in that board with windows me also.
many thanks

 

[KILLorBE]

saint (Jul 05, 2001 09:50 a.m.):
i hope i installed the heatsink well(i just pilled the sticcker from the bottom and put it over the cpu

Welcome to the forum saint

I'm not sure, but do you use the "thermal pad" ?
If you do, get it of and use thermal compound, with a bit of luck your temps will drop a few degrees.

 

[Hoot]

ASUS Probe is infamous for reading the temp higher than it really is. It can be off by as much as 10C. It seems that everyone knows about this except ASUS. Go figure...

It sounds like you used the thermal interface pad that came with your heatsink. They do not perform as well as a quality heat transfer grease, like Arctic Silver, even DOW 340. Most anyone with heat experience will advise you to remove that pad from the base of your HSF, clean and degrease it, as well as the CPU core, very well and reinstall it with heat transfer grease. That should buy you back some temperature. Possibly as much as 5-10C. If you want to really "Go for the Gold", then also consider lapping the heatsink base to smooth it out and ensure flatness. Step-by-step articles on this abound. You just need a few sheets of wet-or-dry sandpaper. Depending upon the existing finish on your HSF baseplate, lapping can buy you back a few additional degrees. Remember, the cooler you can run your CPU at, the happier it will be, not to mention more stable.

Hoot

P.S. Welcome to Overclockers.com Forums.

 

[Ridenow]

The Coolermaster is known as a OK performer, but not the best. I have had good luck with Global Win. Like Hoot and KILLorBE said, remove tha pad and use some thermal compound. Acetone is the recomended solvent for removing the pad. There are some tips on the home page about applying thermal compound. This is one of those "less is more" things. Any questions, you know where to ask. Welcome to the forum.

 

[saint]

first off all thanks guys for your time and your advise
i will try to remove the thermal pad and get the material you advised on

 

[JCLJorgenson]

I was in your exact same situation - with a 1333 Athlon. Look for my post titled Arctic Silver II sucks! I don't know what to do about my heat. If you manage to get your's down, please let me know at [email protected].

Thanks!

 

[Derek]

I had the same problem with a 1333 I switched to a globalwin fop 38 and that brought it down to 125 F under full load,not great but alot better than 145+

 

[Da Whip]

Although the Coolermaster is rated for 1.4gig CPU's, it is just barely doing the job. You should get a better HSF and some A/S 2. Your temps will drop dramatically, if done correctly they should be in the upper 30c to low 40c.

http://www.extremeoverclocking.com/reviews/cooling/HS_Comparison_0701_1.html

Here is a review of some of the newest and best HSF's. Good luck.

 

[Torter]

BE VERY CAREFUL when removing your heatsink. i had a new 1.2Ghz 266 AXIA T-bird and broke my cpu core when removing my temporary air cooling solution, was about to place my watercooling setup back on it after some revisions. the HSF cybercooler i was using is the copper one that has all the radiator like fins and moves air through the cooler sideways. i think it was a cybercooler p-5500.

removal of the thermal pad and the use of thermal paste would help for sure. i have no experience with testing LAPPED vs. UNLAPPED cooling surfaces. so, i can't say anything about that for sure. it seems to me that with the thermal paste filling in voids between the cpu and heatsink, the smooth surface would not increase and could possible decrease the heat transfer. i say that because the heat transfer surface area is all that is important, given a specific thermal compound.

proceed with caution.