- Joined
- Apr 22, 2001
- Location
- Fresno, CA
I was checking out the cray website and it says it is cooled at 4kw per processor....wow! wasn't there a cray that was totally submerged in water.....I bet somebody could do that here with extreme modding. that would be cool to see.
Update:
I found some cool answers to my questions:
"The development of Cray cooling technology allowed each technology generation to increase the circuit board density. "Someone (perhaps Gary Smaby? I truly don't remember) once said that Cray Research was primarily a refrigerator company."
Cray-1: Single sided boards clamped to copper plates placed in aluminium racks that had cooling fluid in tubes.
XMP: Double side sandwich boards clamped to twin copper plates placed in aluminium racks which had cooling fluid in tubes.
Cray-2,3,4: Immersion cooling. The CPU and memory boards sat in a bath of electrically inert cooling fluid.
YMP, C90, T3d LC, T3e MC: Double-sided circuit boards clamped to hollow aluminium boards in which the cooling fluid circulated.
El,J90,T3eAC,SV-1: Blown air cooling.
T90: Immersion cooling. The CPU and memory boards sat in a bath of electrically inert cooling fluid.
So the main forms of cooling were conduction to external cooling, conduction to internal coolant, blown air cooling and total immersion cooling. There was some research done into sprayed coolant methods for J90 modules, reported in an internal technical symposium paper, but this did not make it into a publicly available product."
total immersion.....yum
I bet they use HUGE fans for the aircooling
Update:
I found some cool answers to my questions:
"The development of Cray cooling technology allowed each technology generation to increase the circuit board density. "Someone (perhaps Gary Smaby? I truly don't remember) once said that Cray Research was primarily a refrigerator company."
Cray-1: Single sided boards clamped to copper plates placed in aluminium racks that had cooling fluid in tubes.
XMP: Double side sandwich boards clamped to twin copper plates placed in aluminium racks which had cooling fluid in tubes.
Cray-2,3,4: Immersion cooling. The CPU and memory boards sat in a bath of electrically inert cooling fluid.
YMP, C90, T3d LC, T3e MC: Double-sided circuit boards clamped to hollow aluminium boards in which the cooling fluid circulated.
El,J90,T3eAC,SV-1: Blown air cooling.
T90: Immersion cooling. The CPU and memory boards sat in a bath of electrically inert cooling fluid.
So the main forms of cooling were conduction to external cooling, conduction to internal coolant, blown air cooling and total immersion cooling. There was some research done into sprayed coolant methods for J90 modules, reported in an internal technical symposium paper, but this did not make it into a publicly available product."
total immersion.....yum
I bet they use HUGE fans for the aircooling
