- Joined
- Dec 18, 2000
- Location
- Kent, UK
After deciding against welding my BlOrb (too much hassel according to my engineer mate). I have been trying to come up better ways of expanding the overly-small heatplate. I have seen the copper bottomed Orb, from the front page.
I was wondering about building up a layer of Thermal Epoxy to square-off the overly small base, to make full contact with my Gf2 chip. It would be lapped afterwards, naturally.
I'm just wondering about the feasibility, and cooling properties of such a move...
All help appreciated in advance.
I was wondering about building up a layer of Thermal Epoxy to square-off the overly small base, to make full contact with my Gf2 chip. It would be lapped afterwards, naturally.
I'm just wondering about the feasibility, and cooling properties of such a move...
All help appreciated in advance.