- Joined
- Feb 11, 2002
- Location
- Seattle area
I love this site, and this forum. Overclocking and CPU cooling are seriously habit forming. However, I have a small gripe, or maybe just puzzled thoughts that need direction.
I just finished reading several of the o/c.com articles on thermal testing and the questionable methods by which people measure and interprete temps. While it all sounded very good, something doesn't jive at all.
People will take a perfectly good HSF or waterblock, and spend hours carefully lapping it to a mirror perfection, then apply the most expensive thermal grease, and employ some perfected clamping method, all to achieve the optimal thermal mating of two components. All this is done to achieve a measurable improvement in core temps, and eek out one more notch on the overclocking hall of fame.
NOW I read that those same people are perfectly willing--even suggesting--drilling a tiny hole in the HSF to house a thermalcouple for optimal temp reading. I'm not sure how small a hole a thermalcouple can slip into, but even a 1mm hole covers about 1% of the core's surface, and you're putting it right at the hottest point. Filling a visible hole with AS3 is most certainly worse than using the same compound to correct the block's original, non-visible imperfections you spent so many hours getting rid of.
So, what am I missing here? Did these guys key their own car-door to demonstrate how good a paint job they did?
I just finished reading several of the o/c.com articles on thermal testing and the questionable methods by which people measure and interprete temps. While it all sounded very good, something doesn't jive at all.
People will take a perfectly good HSF or waterblock, and spend hours carefully lapping it to a mirror perfection, then apply the most expensive thermal grease, and employ some perfected clamping method, all to achieve the optimal thermal mating of two components. All this is done to achieve a measurable improvement in core temps, and eek out one more notch on the overclocking hall of fame.
NOW I read that those same people are perfectly willing--even suggesting--drilling a tiny hole in the HSF to house a thermalcouple for optimal temp reading. I'm not sure how small a hole a thermalcouple can slip into, but even a 1mm hole covers about 1% of the core's surface, and you're putting it right at the hottest point. Filling a visible hole with AS3 is most certainly worse than using the same compound to correct the block's original, non-visible imperfections you spent so many hours getting rid of.
So, what am I missing here? Did these guys key their own car-door to demonstrate how good a paint job they did?