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Heat sink application woes

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Dec 21, 2000

I had a Globalwin FEP-32 latched nicely on my old celeron 366 which took it easily up to 572 and I was happy. I just recieved my cco stepping p3-700 and my efforts to latch it flush with the little chip have been completely in vain. At first I thought I would sand down the little ridge that's built on to the heatsink (apparently to let you know what side to put it on) but even after that I'm still only able to have 1/4 of the chip in contact with the heatsink. Basically, my problem is the arm origin side of my slocket (the plastic part that says PGA370) is raised up as to tilt the heatsink up away from the chip, preventing it from sitting flush across the chip. I really want to get up and running but I refuse to try and compensate for the visible light that filters thru by glopping on a bunch of thermal paste. Anyone have any ideas?
Why not go get another HSF that is specifically designed the p3. Afterall, design differences may be why you old FOP doesn't fit anymore and you shouldn't continue to force it onto the P3. It's like wearing shoes one size too small!!