- Joined
- Jun 22, 2001
OK, first, I need a liquid with decent thermal conductivity properties that is *not* electrically conductive. Fluorocarbons come to mind, but the high vapor pressure is a problem. Any others out there?
If yo have an insulating liquid, there is no need for a water block. I want to develop a block that attaches directly to the chip package so that the liquid can flow directly over the die. No more AS, no more clamping, no more worries about heat transfer to the waterblock. I once say a picture of a television operating completely submerged in a vat of some fluorocarbon and that gave me the idea. Comments? Will this work? Has anyone done this before?
If yo have an insulating liquid, there is no need for a water block. I want to develop a block that attaches directly to the chip package so that the liquid can flow directly over the die. No more AS, no more clamping, no more worries about heat transfer to the waterblock. I once say a picture of a television operating completely submerged in a vat of some fluorocarbon and that gave me the idea. Comments? Will this work? Has anyone done this before?