Yep, well I don't know I'm thinking of delidding the CPU. Then the next step would be to buy a Corsair or any brand water cooler system.
OK, when delidding the CPU, is the paste to between the chip and the cover the same to put between the CPU and the evo 212 ?
You can use the same paste but the temp improvement will be very limited unless you put liquid metal TIM under the lid. Liquid metal transfers heat much better than conventional thermal grease. But you will still want to use the conventional on the top side. Using liquid metal on top can be dangerous since it is not contained and when you pull off a cooler the liquid metal flakes can lodge in other places on the motherbord. The biggest need is to improve the heat transfer under the lid between the CPU die and the IHS because that is such a small contact area. Using liquid metal (aka, LM) on the top side may lower temps a couple of degrees but not a big effect.
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Also do I need a silicon glue for the CPU cover ? I got this information from a Gamers Nexus video about delidding CPU.
No, you will not need silicone glue. Most folks just place the lid back on and it will be held in place by the socket clamp. But you would want to apply LM to both the top of the CPU die and the underside of the IHS. I would not use silicone glue to refasten the lid for another reason. It puts a layer of material between the PCB and the IHS perimeter, thereby creating more of gap between the IHS and the CPU die. I.E, it raises it up off the PCB a little and doesn't give as good a contact between the underside of the IHS (Integrated Heat Spreader) and the top of the CPU die.
Is this one OK ?
https://www.amazon.com/Halnziye-Con...92603895&sprefix=cpu+silicone+,aps,316&sr=8-1
It is mentioned that it's a conductive glue, is that a problem for CPU delidding ?