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Insight on AMD Technological Innovation

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I saw in the document that the author mentioned there would be an availability of 90nm AMD64s in 2004.

However, he never mentioned when FDSOI (Freely Distributed Silicon on Insulator, correct me if I'm wrong) would be implemented.

Might any of you know?
 
AFAIK FDSOI is not expected until next year or even 2007. After all they are only just about to roll out DSL. I will find the relevant link.
 
FDSOI stands for "fully depleted SOI".

FDSOI is an improved form of SOI with a much thiner top layer of silicon where the transistors are built, resulting in lower power, lower parasitic capcitance and higher performance.

In additional to the various forms of strained silicon on insulator (SSDOI, DSL), FDSOI and metal gate (instead of polysilicon gate used in current technology) are some of the silicon technologies that will be potentially introduced to advance silicon manufacturing through 65 nm, 45 nm and beyond.
 
Good to know that I wasn't losing my vision when I read something along the lines of...

FDSOI = possible 25nm chip process technolgy

Clarification greatly appreciated.
 
I think it is good and important that, from time to time and actively, we talk about the underlying science and engineering principles, next generation silicon technologies, guesses and predictions of next generation chips and performance, than just pushing voltages, lowering temperature in overclocking. After all, they are all inter-related, understanding some science and future (silicon) technologies will help to design better systems and get the systems better optimized (aka overclocking).
 
Please start by talking about the jump from Toledo to Orleans/Windsor i.e. differences, expected overclocking potentials and expected difficulties expanding in particular to possible increase in 'sudden death syndrom' cases of future 65nm CPUs.
 
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