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- Feb 1, 2011
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This is pretty thorough for day one. As the weeks go by I'm confident that we'll see a mashup of all the combinations available posted here and elsewhere. This is just the beginning.
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You would be the first person to say that. The couple of reviews I have read say the opposite. Can you link one up that shows what you are saying between broadwell and skylake?
EDIT: I should clarify.. Skylake is faster (IPC) than Broadwell except in the rare instance where the eDRAM on die is used.![]()
That is the eDRAM coming into play as I mentioned.Yes, maybe I'm not right in all cases as in some graphics, compression etc applications skylake looks better but there are tests like in below link where results are the same or nearly the same while broadwell has much lower stock clock. There are only results without OC so hard to say exactly but 5775C is 3.3-3.7GHz chip while 6700K is 4.0-4.2GHz chip.
http://www.guru3d.com/articles_pages/core_i7_6700k_processor_review_desktop_skylake,16.html
I saw some more but don't remember where. Anyway it's not really important as barely anyone will buy broadwell in higher price.
In our discrete gaming benchmarks, at 3GHz Skylake actually performs worse than Haswell at an equivalent clockspeed, giving up an average of 1.3% performance. We don’t have much from Intel as to analyze the architecture to see why this happens, and it is pretty arguable that it is noticeable, but it is there. Hopefully this is just a teething issue with the new platform.
When we ratchet the CPUs back up to their regular, stock clockspeeds, we see a gap worth discussing. Overall at stock, the i7-6700K is an average 37% faster than Sandy Bridge in CPU benchmarks, 19% faster than the i7-4770K, and 5% faster than the Devil’s Canyon based i7-4790K. Certain benchmarks like HandBrake, Hybrid x265, and Google Octane get substantially bigger gains, suggesting that Skylake’s strengths may lie in fixed function hardware under the hood...
If they're still using TIM they definitely refined the process. Those XTU temps are very good.
I would have to guess with the temps we had that it may be solder...? But really not sure. That is just a guess and here is why I say that...: I was sitting at 4.9Ghz and 1.449v and didn't hit 70C. BUT... the voltage difference (1.3v stock to 1.449v) is not as much as the jump from 1.1v to 1.45v I had to use with 4790K.
The FIVR is also gone so that saves a few C there as well... so, in the end, we will have to wait like Dino said.![]()
After further reading from another forum, I have heard two things...Really? I don't see that from the data presented in the linked article. Especially considering the smaller FAB process and the removal of the voltage regulator.
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Really? I don't see that from the data presented in the linked article. Especially considering the smaller FAB process and the removal of the voltage regulator.
Typically, with a smaller FAB process comes lower voltage. But, (and this is my guess here again), due to the FIVR not being on die, the starting voltage is much higher than with Haswell where most chips started around 1.15v give or take, Skylake is starting out, at least mine and Dino's sample, around 1.3v. I have seen others around 1.24v. So there is that to consider as well.
But I believe you are correct. The more dense something is, the more difficult it is to get the heat out it.
So with the voltage regulator now on the motherboard, is that going to present an issue with regard to cooling that component? When it was on the CPU die it got cooled with everything else in the chip.
So, the voltage regulation component that has been moved off the CPU die onto the motherboard is not the same as what we call the VRM which lives next to the socket and has mosfets, chokes and capacitors. Correct?
The other big part of the Haswell power story is what Intel is calling FIVR: Haswell’s Fully Integrated Voltage Regulator. Through a combination of on-die and on-package circuitry (mostly inductors on-package), Haswell assumes responsibility of distributing voltages to individual blocks and controllers (e.g. PCIe controller, memory controller, processor graphics, etc...). With FIVR, it’s easy to implement tons of voltage rails - which is why Intel doubled the number of internal voltage rails. With more independent voltage rails, there’s more fine grained control over the power delivered to various blocks of Haswell.
Thanks to a relatively high input voltage (on the order of 1.8V), it’s possible to generate quite a bit of current on-package and efficiently distribute power to all areas of the chip. Voltage ramps are 5 - 10x quicker with FIVR than with a traditional on-board voltage regulator implementation.
In order to ensure broad compatibility with memory types, there’s a second input voltage for DRAM as well.
So why on my z97 motherboard do I have a big heatsink just west of the socket? That's not the VRM it's cooling? Sorry, but I'm coming from a long time AMD experience.