Lap the core/die????

[RainMaQer]

Does anyone lap there XP core/die? I just noticed that the markings on it are kinda rough... just wondering if anyone has lapped it and gotten better results... or if it's even safe (relatively speaking of course). Thanks.

 

[NASsoccer]

this is truly a nono on the athlons/xps. the outside of the core is not very thick.

 

[RainMaQer]

this is truly a nono on the athlons/xps. the outside of the core is not very thick.

Hmmm... how thick is "not very thick"? So just rubbing off the markings or making them less course wouldn't be a good idea?

 

[NASsoccer]

while i don't know the exact measurement i know that xp's are very easy to crack as it seems the core is more fragile than the old athlons which was very fragile. I would think that if all you did was rub off the markings then you wouldn't gain anything as far as better temps and performance. I think that to get a gain you would have to lap it very well and by then you would be halfway through core. The core is already flat and that is what lapping is supposed to accomplish.

 

[RainMaQer]

while i don't know the exact measurement i know that xp's are very easy to crack as it seems the core is more fragile than the old athlons which was very fragile. I would think that if all you did was rub off the markings then you wouldn't gain anything as far as better temps and performance. I think that to get a gain you would have to lap it very well and by then you would be halfway through core. The core is already flat and that is what lapping is supposed to accomplish.

Have you dragged your fingernail across those markings? I'd think that if they weren't there that would be more die to hsf contact area being made and perhaps drop the temps... you do have a good point... once those markings were flush that wouldn't leave too much of the surface thickness left... hmmm... AMD needs to do what intel does... leave stuff OFF of the die.

 

[NASsoccer]

Have you dragged your fingernail across those markings? I'd think that if they weren't there that would be more die to hsf contact area being made and perhaps drop the temps... you do have a good point... once those markings were flush that wouldn't leave too much of the surface thickness left... hmmm... AMD needs to do what intel does... leave stuff OFF of the die.

i certainly agree and i wish it were prossible to have a core without the markings. But, isn't AMD going to move toward the built in heat dissapater thingy that intel uses. certainly that can be lapped

 

[RainMaQer]

i certainly agree and i wish it were prossible to have a core without the markings. But, isn't AMD going to move toward the built in heat dissapater thingy that intel uses. certainly that can be lapped

Wow I had no idea they were going the heatspreader route... I hope they do... THAT could definetly be lapped... or removed

 

[Yodums]

Well, I wouldn't recommend it. People got no more than a .5 degree difference. For a risk of cracking the core, or barely/no temp lost I wouldn't take the chance. The only reason why I would lap it is that, the print leaves marks in the base or the heatsink.

Yodums

 

[deez]

Actually my load temp dropped 3C (46-43) after removing the heat spreader. Wasn't able to OC any higher though

 

[NASsoccer]

that is interesting, what would happen if you put it back on but put some artic alumina or something will a good transfer in there? Think you could see an improvement??

 

[deez]

that is interesting, what would happen if you put it back on but put some artic alumina or something will a good transfer in there? Think you could see an improvement??

I'm positive that temps would go up higher than before if I did this. Intel uses some type of gray thermal compound that is very rubberlike and the whole thing is factory sealed. I had to remove it with a razorblade and credit card.

besides with the heat spreader removed it exposes a small rectangular core just like the AMD's and that core is in direct contact with my heatsink now. (using AS3 of course)

 

[mustangman]

i certainly agree and i wish it were prossible to have a core without the markings. But, isn't AMD going to move toward the built in heat dissapater thingy that intel uses. certainly that can be lapped

AMD has said that the hammers will use IHS (integrated heatsink.)

 

[NASsoccer]

I'm positive that temps would go up higher than before if I did this. Intel uses some type of gray thermal compound that is very rubberlike and the whole thing is factory sealed. I had to remove it with a razorblade and credit card.

besides with the heat spreader removed it exposes a small rectangular core just like the AMD's and that core is in direct contact with my heatsink now. (using AS3 of course)

Up from the factory defaults with grey stuff or up from your temps with the heatspreader off??

 

[deez]

I think it would be up from both...there is no way I can get that IHS back on as well as the factory did

 

[NASsoccer]

I think it would be up from both...there is no way I can get that IHS back on as well as the factory did

of course if you didn't want it back off-- what about aa epoxy that would put it back on real nice , anyway i thought the idea was worth a try