- Joined
- Jun 11, 2004
d94, maybe I'm missing your point, but the IHS won't make a small die CPU transfer heat like a large die CPU. The spreader is too thin to really spread the heat much at all, and if it were thick enough to do that job, it would present an even larger thermal barrier than it already does. It's really just a protective shield and does not improve the thermal properties of the CPU at all.d94 said:good to hear its not leaking!
however, the appogge is optimized for more surface area, so the smaller the contact the worse the temps in theory. i believe it's pedessor is the one for smaller dies
regardless i want results!
That said, I have to agree with Voigts. Especially since at least one corner of every IHS-less AMD CPU die I've ever seen with my own eyes had been ground off by the heatsink. It's very easy to damage those things when they're bare. And while I'm all for minimizing thermal resistance, I can't say I think AMD made the wrong move when they started capping their CPU dies. My only gripe is that they didn't make it a heatpipe the full size of the CPU package with the working fluid in direct contact with the die. Now that would be a heatspreader.