- Joined
- Sep 28, 2004
Since my buddy now has access to machine time, I thought I'd venture into extreme cooling. Copper is too expensive but brass is free. So what dimensions would be good for brass to cool chips including Prescotts and C2Ds? I'm looking for base, wall, column diameter and height.
We were also thinking of machine a column of brass, and press fitting a copper puck into the bottom. Is there any issue of the copper shrinking loads more than the brass and the puck coming free? My friend can get LN2, so I'll be using that as well as DICE. I was also going to leave an 1/8th inch lip of metal around the column partway up to mount it.
Thanks in advance, and I promise pics when its done!
Edit: Just found out the thermal conductivity of brass kinda sucks, even compared to Al. I'll see if Al is an option.
We were also thinking of machine a column of brass, and press fitting a copper puck into the bottom. Is there any issue of the copper shrinking loads more than the brass and the puck coming free? My friend can get LN2, so I'll be using that as well as DICE. I was also going to leave an 1/8th inch lip of metal around the column partway up to mount it.
Thanks in advance, and I promise pics when its done!
Edit: Just found out the thermal conductivity of brass kinda sucks, even compared to Al. I'll see if Al is an option.
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