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so its a high tec pelt but did you see the part about hps inkjet printer device to dispense dielectric fluid to cool chips WOW gotta see thaterikss0n said:some more info...
Remember that product will be presented 18-22 November at COMDEX.
ACTIVE COOL ON Monday is launching its AC4G CPU cooling system, a thermo-electric apparatus designed to address the processor heat "crisis," according to the company.
As PC processors get smaller and faster, heat remains a challenge to system reliability, Active Cool said. The company claims its system, based on a solid-state thermo-electric heat pump, can cool the most advanced Intel Pentium 4 processors and AMD K8 processors. The ACG4 pumps heat out of the processor and dynamically reduces fan noise through use of a noiseless electronic heat pump.
Active Cool's system, which occupies a PCI slot, features microprocessor-controlled thermo-electric cooling, maintenance of PC temperatures at 26 Centigrade during normal operation, and independent operation from the PC.
The technology is based on thermo-electric components used in aerospace and military applications, said Ronen Meir, founder and president of the Ashkelon, Israel-based company. The technology can cool chips with speeds of as much as 4GHz, he said.
Initially, Active Cool intends to sell its technology through conventional cooling system manufacturers. In about a year, the company will approach PC manufacturers to either sell or license it to them, Meir said.
Hewlett-Packard this summer announced that it, too, is working on system-cooling technologies, applying its inkjet printer device to dispense dielectric fluid to cool chips.
sillyunclemark said:Also hints that the claims are only good for office apps. Both the fan and cooling unit are variable.
Thanks for pointing that out. That statement may well be key, and seems to mesh well with earlier statements.
Hope they expect the NORMAL user to have case airflow that can handle an extra 150W or better
macklin01 said:Looks to be an AC/DC adapter at the back of the PCI part of the module. Another type of product that uses this sort of trick is Cenatek's solid-state ramdisk. (ECC SD-RAM with its own controller in a PCI slot, with its own battery backup and external power supply through the back of the PCI slot.)
The PCI interface may or may not actually communicate with the PC (e.g., report power usage, monitor CPU usage in its determination), as it is supposed to have its own microchip and it would be farily safe to assume it has its own temp probes.
It almost looks like the PCI deal is a convenient way to mount it in the case w/o cutting holes, hacking the PSU, etc.
What may make the difference for theirs is that they don't have to juice up the pelt to 100% (or 70-80%) all of the time, as its usage is tied to the CPU temp and usage. So, it isn't quite as difficult to cool as a pelt setup around here that runs at the same level all the time. 24-7 folding would be an interesting test, though.
Perhaps what's ``revolutionary'' about this product is that it brings TEC cooling to the mainstream with completely non-obtrusive installation. No case modding, no extra PSU to install, or anything. Similar to efforts to sell self-contained watercooling kits, but without the mess.
It would probably do the most good in the OEM area in the future -- not for huge overclocking -- just to enhance performance of existing HS technology without exceeding aircraft-level fan noise. Good for the general population. Now, it would be really interesting if this company teamed up with the coolchips company (which is essentially developing ultra-efficient TEC components). Then, it would be especially easy to cool with a hsf.
Just a few thoughts. Probably sums to $.015.