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silver 5 compound

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dkizzy

Member
Joined
Nov 22, 2006
Location
PA
I picked up the ocz ultra 5+ compound and I was wondering the best way to distribute it? Do I use like a credit card and make a thin layer over the entire chip or what?
 
I use a latex glove or a hard plastic (similiar to a CC) and just smear it around. Some say to do it on the heatsink, but the area that the HS covers is greater then the IHS of the chip. Make sure both surfaces are clean too. I whipe mine down with 91% Isopropyl Alcohol before I do
 
Yeah, the ricegrain works in theory, but I am not a fan of it, especially since if the sink is not mounted in one shot evenly, it's going to be worse off than spreading it on the IHS.

My personal favorite method is to put a little less than half a rice grain on the IHS, spread it, then whatever is left on your spreading material, put that on the heatsink...

But to each his own :D If you are mounting a waterblock the pressure of the heatsink spreading it works best. But most metods require the torqueing of some kind of retention which I am not a fan of for pressure spreading.
 
(Clanger)(DOA) said:
well would the surfaces being lapped change the application method??
Not that I know of.

The instructions are for a smooth surface. I bet they have tested many times and ways how to best apply the materail. Once you learn how the manufacturer says to apply it. Then season to taste. I found following the directions is best for me and the many times I have used it. There has been once applying it, that going on my experiance worked best.

It is easier to mention the offfical way to apply it. Then if the person does something wrong and gets really high temps. (Not all HS are flat or IHS's.) You can walk them through until it is right. Plus possibly troubleshoot application issues or mounting troubles. Not only is is easier, it can relieve any issues along the way. Not everyone knows the correct amount to apply on the IHS. To much and you get a thermal barrier. To liitle and you don't get heat removal. Plus as I mentioned, if the HS is not a flat surface. It can also cause high temps.

After a few times using TIM. A user can start finding out what is best for them. Following the instructions seems to be the fastest and easiet way to get that messy goop on clean and quick.
 
I also like to spread it across the CPU Die (I use a Credit Card), and use the leftover on the HS. A VERY thin layer is all you need. I also Lap my HS's, so this may vary with non-lapped HS's...

I also like to rotate/slide the HS a little before I attach it - this spreads the AS5 even further.

I was not a huge fan of the one dot of AS5 in the middle - but whatever works for you is fine...

:cool:
 
Enablingwolf said:
Not that I know of.

The instructions are for a smooth surface. I bet they have tested many times and ways how to best apply the materail. Once you learn how the manufacturer says to apply it. Then season to taste. I found following the directions is best for me and the many times I have used it. There has been once applying it, that going on my experiance worked best.

It is easier to mention the offfical way to apply it. Then if the person does something wrong and gets really high temps. (Not all HS are flat or IHS's.) You can walk them through until it is right. Plus possibly troubleshoot application issues or mounting troubles. Not only is is easier, it can relieve any issues along the way. Not everyone knows the correct amount to apply on the IHS. To much and you get a thermal barrier. To liitle and you don't get heat removal. Plus as I mentioned, if the HS is not a flat surface. It can also cause high temps.

After a few times using TIM. A user can start finding out what is best for them. Following the instructions seems to be the fastest and easiet way to get that messy goop on clean and quick.
That is about it I think. After a few applications one can learn to adjust the amount of paste to suit their particular situation. Two smooth flat surfaces will require less. And I believe one reason AS recommends the "rice grain in middle" method is to help elminate air pockets. Seems I remember Nevin from AS saying they perfected this by using a piece of glass to observe how the paste spread.

On a lighter note, be careful spreading it with your finger because everyone knows Silver is highy toxic and
will cause your pecker to dry up & fall off. ..... just kidding! < wink ;) >
 
I used the rice grain size in the middle and pressure of the heatsink to spread it. Helps keep air from getting trapped.
 
OCZ Ultra 5+ is the exact same product as Arctic Silver 5, just rebranded. The BEST thing to do is to apply it according to Arctic Silvers instructions. Put a rice sized grain in the middle and mount the heatsink.
 
i put a spot about the size of the o on my keyboard and put them together and take them apart to be sure it is not going over the edge of cpu or other device, if more is needed i add, if it is over the edge i use edge of paper towel to remove excess if any.
on my gpu's i dropped 15 c using artic silver five from mfgr's paste on my cpu i dropped 12 c .
 
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