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Skylake de-lid question

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Aquaman78

Member
Joined
Dec 14, 2008
Location
Kentucky
I'm getting ready to de-lid my 6600k but a thought occurred to me. I have seen people clean the black IHS adhesive from the PCB and IHS and this made me wonder.....doesn't this layer of adhesive create a slight gap between the IHS and PCB? If the IHS is replaced and clamped down, is it possible that without that layer, it is putting more force on the CPU die?
 

jaymz9350

Member
Joined
May 13, 2006
Not sure on skylake but on ivy/Haswell removing the gap was part of the point in deliding as the gap causes a lot of the temp issues
 
OP
Aquaman78

Aquaman78

Member
Joined
Dec 14, 2008
Location
Kentucky
Not sure on skylake but on ivy/Haswell removing the gap was part of the point in deliding as the gap causes a lot of the temp issues
I can definitely see that being an issue....especially if more TIM was used to make up for the poor IHS to die contact.